Amkor Technology Portugal (ATEP)

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        "bodyText": "English 한국어 日本語 简体中文 Document Library Factory Certs Investors Cloud Services Careers Contact Us MENU About Us Amkor Overview Mission Company History Leadership Careers China France Germany Japan Korea Malaysia Philippines Portugal Singapore Taiwan United States Vietnam Smart Manufacturing (I4.0) Corporate Responsibility News Blog Press Releases Events Customer Center Amkor Mechanical Samples B2B Integration Services Cloud Services Document Library Investors Memberships and Partnerships Contact Us Packaging Laminate CABGA/FBGA DSMBGA FCBGA fcCSP FlipStack ® CSP Interposer PoP PBGA/TEPBGA Stacked CSP Leadframe ePad LQFP/TQFP ePad TSSOP/SOIC/SSOP fcMLF ® LQFP Micro LeadFrame ® SOIC SSOP/QSOP TQFP TSSOP/MSOP Memory MEMS and Sensors Power D2PAK (TO-263) DPAK (TO-252) HSON8 LFPAK56 PowerCSP™ PQFN PSMC SO8-FL SOD123-FL SOD128-FL TO-220FP TOLL TSON8-FL System in Package (SiP) Wafer Level WLCSP WLFO/WLCSP+ WLSiP/WL3D Technology 2.5D/3D TSV 3D Stacked Die AiP/AoP Chip-on-Chip Copper Pillar Edge Protection™ Flip Chip Interconnect Optical Sensors Package-on-Package S-Connect™ S-SWIFT™ SWIFT ® Test Services Services Design Services Package Characterization Wafer Bumping Applications Artificial Intelligence Automotive Communications Computing Consumer Industrial Internet of Things Networking Quality Amkor Update on Coronavirus (COVID-19) Home | Amkor Update on Coronavirus (COVID-19) July 15, 2020 Recent Updates: Amkor Technology continues to monitor information from public health organizations and government agencies regarding COVID-19 and is following guidelines from these organizations and governments. Amkor’s principal concerns continue to be the health and safety of employees and safeguarding production output for our customers. Amkor’s global factories are open and operating and are maintaining COVID-19 protocols and heightened corporate hygiene actions, including: No visits to factories No overseas travel Screening at campus entrances for fever and signs of illness Increased hygiene measures at dormitories, canteens and shuttles Requiring masks to be worn and the use of disinfectants for hand washing Additionally, where applicable, Amkor office personnel remain in “Work From Home” status until local conditions are again safe for a staggered “Return To Office” implementation. Questions? Contact an Amkor expert by clicking the request info button below. Request Info on Questions? Connect with us Sign up for email updates from Amkor © Copyright 2026 Amkor Technology ADA Accessibility | Careers | Privacy Notice | Privacy Request | Legal | Sitemap | Contact Us |",
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ATEP offers in-house capabilities for the entire development chain, from design to multiple wafer level packaging and MEMS & sensor technologies to test solutions that respond to the most demanding customer requirements. Amkor’s investments in the capabilities of our Portugal facility allow us to support local supply chain agility and are poised to help our EU-based customers within our 500,000-square-foot, IATF 16949 certified Porto facility. ATEP Advanced Packaging Platforms and Technology Solutions WLCSP Enabling higher content in a small-sized package Learn More about WLCSP WLFO/WLCSP+ Flexibility to enable 3D multi-component package designs Learn More about WLFO/WLCSP+ MEMS & Sensors High volume, standard package platforms for custom solutions Learn More about MEMS & Sensors FCBGA Plated and Copper Pillar, enabling turnkey processing Learn More about FCBGA CuPillar & Bump State-of-the-art wafer bumping capabilities Learn More about CuPillar & Bump Test Services If you can build it, Amkor can test it! Learn More about Test Services Factory Certifications IATF 16949 Amkor Portugal IATF 16949 Certificate ISO 9001 Amkor Portugal ISO 9001 Certificate ISO 14001 Amkor Portugal ISO 14001 Certificate ISO 27001 Amkor Portugal ISO 27001 Certificate ISO 45001 Amkor Portugal ISO 45001 Certificate Information Security Statement of Commitment Amkor Technology Portugal, S.A. is committed to protecting its information and all associated resources, whether procedural, technological, or human. The protection of information is fundamental to the organization’s strategic success and long-term sustainability. To this end, Amkor Technology Portugal, S.A. has established an Information Security Management System (ISMS) equipped with all necessary tools for managing information security and support systems, which ensures, through a risk management approach and continuous improvement, the confidentiality, integrity, and availability of information. Corruption Prevention Plan Plano de Prevenção da Corrupção Amkor Portugal Plano de Prevenção de riscos de corrupção e infrações conexas Amkor Portugal to Invest 150M€ Started at the end of 2023, with completion scheduled for 2027, the project aims to increase production capacity and modernize the technology at Amkor Portugal. Promoter: ATEP – AMKOR TECHNOLOGY PORTUGAL, S.A. Download: ATEP to Invest 150M€ Announcement Microelectronic Agenda Project The microelectronics sector has faced difficulties in accessing and making components and systems available at the European level, whether due to the impact of geopolitical tensions, scarcity of resources, or the breakdown of distribution and production chains caused by the pandemic, which has highlighted the dominance of the Asian market, and the need for Europe to have greater autonomy in this sector, which is so influential and structural for the digital transition. The Microelectronics Agenda was conceived in an integrated manner, with proximity to the European initiatives IPCEI on Microelectronics and the EU Chips Act, aiming to unlock the potential of the semiconductor industry and add value to European society and the economy. The Agenda is the first step in the national response to the European need to overcome its systemic failures in the sector, through structural investments to strengthen productive capacity, innovation, training, and production of relevant information in the national semiconductor industry. Consortium leader: ATEP – AMKOR TECHNOLOGY PORTUGAL, S.A. Download: Project Sheet Microelectronic Agenda   Decarbonization Project Implementation of an energy production system for self-consumption, from a renewable source, avoiding 444,19 tCO2 of GHG emissions per year. Promoter: ATEP – AMKOR TECHNOLOGY PORTUGAL, S.A. Download: ATEP Decarbonization Project Overview Questions? Contact an Amkor expert by clicking the request info button below. Request Info on Questions? Connect with us Sign up for email updates from Amkor © Copyright 2026 Amkor Technology ADA Accessibility | Careers | Privacy Notice | Privacy Request | Legal | Sitemap | Contact Us |",
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        "bodyText": "English 한국어 日本語 简体中文 Document Library Factory Certs Investors Cloud Services Careers Contact Us MENU About Us Amkor Overview Mission Company History Leadership Careers China France Germany Japan Korea Malaysia Philippines Portugal Singapore Taiwan United States Vietnam Smart Manufacturing (I4.0) Corporate Responsibility News Blog Press Releases Events Customer Center Amkor Mechanical Samples B2B Integration Services Cloud Services Document Library Investors Memberships and Partnerships Contact Us Packaging Laminate CABGA/FBGA DSMBGA FCBGA fcCSP FlipStack ® CSP Interposer PoP PBGA/TEPBGA Stacked CSP Leadframe ePad LQFP/TQFP ePad TSSOP/SOIC/SSOP fcMLF ® LQFP Micro LeadFrame ® SOIC SSOP/QSOP TQFP TSSOP/MSOP Memory MEMS and Sensors Power D2PAK (TO-263) DPAK (TO-252) HSON8 LFPAK56 PowerCSP™ PQFN PSMC SO8-FL SOD123-FL SOD128-FL TO-220FP TOLL TSON8-FL System in Package (SiP) Wafer Level WLCSP WLFO/WLCSP+ WLSiP/WL3D Technology 2.5D/3D TSV 3D Stacked Die AiP/AoP Chip-on-Chip Copper Pillar Edge Protection™ Flip Chip Interconnect Optical Sensors Package-on-Package S-Connect™ S-SWIFT™ SWIFT ® Test Services Services Design Services Package Characterization Wafer Bumping Applications Artificial Intelligence Automotive Communications Computing Consumer Industrial Internet of Things Networking Quality Amkor Advances Arizona’s Semiconductor Future Innovating the future of semiconductor packaging, creating local opportunities and strengthening our community Home | Amkor Technology Arizona Fortifying domestic supply chain resilience: Amkor’s commitment to a robust American semiconductor ecosystem The establishment of Amkor’s next factory in Arizona stems from the US CHIPS Act initiative to strengthen domestic semiconductor supply chains. After evaluating multiple states, we selected Peoria, Arizona, due to its strategic advantages, including proximity to TSMC (the world’s largest silicon foundry). This location enables us to create a robust ecosystem alongside TSMC, Intel, and other industry leaders, leveraging shared educational resources, supplier networks, and technical services. Facility Overview Workforce Hiring Needs Timeline Webinars Located in north Peoria at the Peoria Innovation Core, the facility will specialize in advanced packaging and test technologies for artificial intelligence, high-performance computing, mobile applications, communications, and the automotive and industrial sectors. Featuring high automation for optimized cycle times and cost competitiveness, it will provide rapid yield feedback to US wafer fabrication plants. Upon completion of phase 1, the facility will employ over 1,300 local workers. We understand the critical importance of recruiting, training, and retaining a diverse and skilled workforce to fill the jobs needed to operate our advanced packaging facility. Amkor provides training programs and supports its employees’ development, guiding new employees through orientation, basic training, manufacturing line training, certification, and ongoing on-the-job training. Through established partnerships with several educational institutions, we will leverage existing programs and incorporate our specific needs to ensure access to a qualified stream of people, which will benefit both the community and our organization. We expect to enable apprenticeship programs so future graduates can go to school and have internships concurrently in our factory, work with a mentor, and learn equipment operation and maintenance. Our team is partnering with state and local workforce development boards, commissions, advisory boards and the Arizona Department of Education to create pathways for students and adults to our industry. Our workforce comprises professionals from various educational backgrounds and disciplines, creating a well-balanced technical environment where diverse perspectives drive innovation and excellence. Engineering Positions We seek candidates with bachelor’s degrees in materials science, electrical engineering, mechanical engineering, chemical engineering and related fields. Our engineering team benefits from this diverse technical background, enhancing problem-solving capabilities and decision-making processes. Technical Roles Technicians with associate degrees and/or relevant certifications in process technology, maintenance, testing and related technical fields are critical to our operations. These skilled professionals ensure the smooth functioning of our advanced manufacturing processes. Manufacturing Operations Our operators, typically with high school diplomas and specialized training, play an essential role in maintaining production excellence and efficiency throughout our facilities. Manufacturing Support These varied positions require bachelor’s degrees across numerous disciplines. Team members in facilities management, procurement, supply chain, planning, customer service, and quality assurance provide the infrastructure that enables our technical operations to succeed. 2025 Construction of Phase 1 begins in September 2025 and will continue through mid-2027 2026 Recruiting and hiring of our workforce, including, but not limited to, engineers, technicians and operators to ensure a ready team in preparation for production 2027 Tool installation, line verification, and qualification 2028 Production is expected to start in the early part of the year Beyond Phase 2 timing is dependent upon customer demand Episode 1: Chemical Handling Senior Vice President David McCann highlights Amkor’s approach to chemical safety and its collaboration with local authorities to support public safety and emergency preparedness. This webinar outlines Amkor’s protocols for safe chemical handling, including the use of material safety data sheets and strict procedures for material storage, handling and disposal.   Episode 2: Water Safety Senior Vice President David McCann outlines Amkor’s comprehensive water conservation strategy and commitment to environmental stewardship. This webinar details Amkor’s multi-layered approach to water protection, including advanced pretreatment systems that will clean wastewater to levels significantly exceeding Peoria’s requirements and eliminate PFAS contamination through specialized processing partnerships.   Episode 3: Air Quality This webinar outlines Amkor’s comprehensive air quality protection strategy for its facility in Peoria, Arizona, as defined by Senior Vice President David McCann. Amkor’s approach features hospital-grade HEPA filtration systems and advanced emissions control that will ensure air quality far surpasses federal standards. Amkor Technology Arizona and green manufacturing Our stated ESG mission is to pursue agile and dependable manufacturing that drives sustainable practices, aligns with our core values of reliability and trust and maintains our commitments to our communities, customers, suppliers, employees, business partners and shareholders. Net-Zero Goal At Amkor Technology, we are deeply committed to the communities we serve and the environment we share. By adhering to the Science Based Targets initiative (SBTi), we have established ambitious, verified goals that demonstrate our dedication to sustainable manufacturing. We’re actively working to reduce our absolute Scope 1 and 2 greenhouse gas emissions by 55% by 2030, with an ultimate target of achieving net zero emissions by 2050. Our environmental strategy aligns with leading industry standards through our participation in the Responsible Business Alliance, and Responsible Mineral Initiative, and compliance with Sustainability Accounting Standards Board guidelines. Beyond emissions, we’ve set concrete goals to reduce water usage and waste generation by 20% by 2030, and we proudly support the City of Peoria’s initiatives to maximize water reclamation. These science-based commitments reflect our holistic approach to environmental stewardship and our responsibility to both our local community and the global ecosystem. Discover more about our ESG mission ! Water Management At our new Peoria facility, Amkor is implementing comprehensive water management strategies that reflect our deep commitment to environmental stewardship and community responsibility. We’ve designed our operations to limit consumption, with at least 80% of water coming from reclaimed sources. Our facility will feature a state-of-the-art industrial wastewater pretreatment program that adheres to all federal, state, and municipal requirements, building on our extensive experience with wastewater management across our global operations. We’re investing in advanced purification systems that enable us to use reclaimed water in our semiconductor assembly processes, demonstrating our dedication to conservation in water-sensitive Arizona. Furthermore, we’ve established a collaborative partnership with the City of Peoria to continuously improve wastewater processing techniques, ensuring that water can be effectively recycled within our operations. This approach not only minimizes our environmental footprint but also supports the long-term sustainability of water resources in the community we’re proud to join. Noise Management Amkor is committed to being a good neighbor to Peoria residents through responsible noise management at our new facility. While Peoria city code permits sound levels up to 80 dBA during daytime hours (6:00 AM-10:00 PM) and 70 dBA overnight (10:00 PM-6:00 AM) when measured at property boundaries, we’re setting a much higher standard. Based on measurements from our largest existing facility, which registers only 44-59 dB—significantly below local requirements—residents can expect minimal noise disruption from our operations. This careful attention to sound levels demonstrates our respect for the community’s quality of life and our dedication to creating a manufacturing environment that harmoniously coexists with surrounding neighborhoods. Our proactive approach to noise mitigation reflects Amkor’s broader commitment to responsible corporate citizenship and environmental stewardship in all the communities where we operate. Career opportunities As one of the most important semiconductor packaging pioneers and the leader in the OSAT (Outsourced Semiconductor Assembly and Test) market, Amkor is relied on by the world’s biggest semiconductor companies to bring their designs to completion. We are seeking top talent to join our Arizona team, where innovation and manufacturing excellence converge in America’s semiconductor corridor. Amkor Technology, Inc. is an Equal Opportunity Employer. Sr. Staff Engineer, Gas & Chemical Job Summary: Amkor Technology Arizona is seeking an experienced facilities Gas and Chemical Engineer, responsible for supporting the ongoing design, construction, commissioning and operations for Gas and Chemical systems. Responsibilities will evolve throughout the project lifecycle, ranging from design and commissioning to full-scale operations, requiring adaptability and a proactive approach to each phase. Essential Duties and Responsibilities: Collaborate with design vendors to ensure gas and chemical system requirements are met Review engineering drawings, submittals, and monitor construction progress Support commissioning activities, including equipment preparation and operational testing Identify and resolve abnormalities during construction and start-up phases Manage documentation, manuals, and handover processes for gas and chemical systems Provide engineering support for operation and maintenance of gas and chemical distribution systems Ensure safe and reliable operation of Gas Cabinets, CDMs, VMBs, VMPs, chemical control systems, and toxic gas monitoring systems Perform system capacity planning, troubleshooting, and sustaining activities to meet production demands Develop and maintain system databases, shutdown plans, and expansion strategies Partner with operations and maintenance teams to optimize performance and reliability Conduct system evaluations and implement improvements through capital and expense projects Maintain accurate documentation for operational and maintenance procedures Apply reliability engineering principles, including FMEA and root cause analysis, to improve system performance Ensure compliance with safety standards, codes, and environmental regulations Required Qualifications: Bachelor’s degree in Chemical Engineering or related field. Master’s degree highly preferred 8+ years of experience in gas and chemical facilities engineering (design and operations) Strong understanding of Gas Cabinets, CDMs, VMBs, VMPs, chemical control systems, and toxic gas monitoring systems Ability to read and interpret engineering drawings and specifications Knowledge of adjacent disciplines (automation, drains, UPW, exhaust, environmental systems) Proficiency in MS Office and engineering tools Strong analytical, decision-making, and time management skills Experience in design, construction, commissioning, and start-up preferred Professional Engineering License (PE) is a plus Physical Requirements: Ability to work in various weather conditions and awkward positions Regularly lift up to 50 lbs. and adjust heavy objects Exposure to sharp, hot, and cold equipment Must be medically qualified to wear a respirator Ability to climb ladders, work at elevation, and in confined spaces with PPE Location: This position will be based at the Arizona Tempe and Peoria sites during the Construction phase and will transition to Peoria for management during the Factory Operation phase. Accept the challenge. Apply Now! Sr. Staff Engineer, Ultra-Pure Water Job Summary: Amkor Technology Arizona is seeking an experienced facilities UPW engineer, responsible for the design, installation, commissioning, and ongoing operation of Ultra-Pure Water (UPW) systems for Amkor’s OSAT factory. This includes RO, EDI, DI, and ultrafiltration systems to ensure reliable and high-quality water supply for our facility. The role supports system performance, compliance, and continuous improvement throughout the project lifecycle. Essential Duties and Responsibilities: Responsibilities will evolve throughout the project lifecycle, ranging from design and commissioning to full-scale operations, requiring adaptability and a proactive approach to each phase. Collaborate with UPW design vendors to ensure system requirements and specifications are met Review engineering drawings, submittals, and monitor construction progress Support commissioning activities, including equipment preparation, operational testing, and system validation Identify and resolve abnormalities during construction and start-up phases Manage documentation, manuals, and handover processes for UPW systems Conduct training and on-the-job training (OJT) for operations and maintenance teams Oversee production and delivery of UPW to site production areas, ensuring system reliability and water quality standards Collaborate with WWT/BRF engineering teams for integrated water management strategies Develop preventive maintenance programs and emergency response procedures Implement technology upgrades to improve reliability, efficiency, and sustainability Perform system capacity planning, troubleshooting, and sustaining activities to meet dynamic production demands Partner with operations and maintenance teams to optimize system performance and streamline maintenance strategies Maintain accurate documentation for operational and maintenance procedures Ensure compliance with environmental regulations and corporate standards Required Qualifications: Bachelor’s degree in Chemical, Mechanical, Environmental, or Process Engineering. Master’s degree highly preferred 8+ years of experience in UPW systems engineering (design and operations), preferably in semiconductor or high-tech manufacturing Strong understanding of UPW systems, water treatment technologies, and industry standards Ability to read and interpret engineering drawings and specifications Knowledge of adjacent disciplines (automation, wastewater, gas, chemicals) Proficiency in MS Office, Bluebeam, and engineering tools Strong analytical, decision-making, and troubleshooting skills Experience in semiconductor facility design, construction, commissioning, and start-up Professional Engineering License (PE) is a plus Physical Requirements: Ability to work in various weather conditions and awkward positions Regularly lift up to 50 lbs. and adjust heavy objects Exposure to sharp, hot, and cold equipment Must be medically qualified to wear a respirator Ability to climb ladders, work at elevation, and in confined spaces with PPE Location: This position will be based at the Arizona Tempe and Peoria sites during the Construction phase and will transition to Peoria for management during the Factory Operation phase. Accept the challenge. Apply Now! Sr. Engineer, Facilities Fire Protection Job Summary: Amkor Technology Arizona is seeking an experienced facilities Fire Protection Engineer, responsible for the design, installation, commissioning, and operation of fire protection systems for Amkor’s OSAT factory. This includes fire suppression systems, fire alarms, sprinkler systems, clean agent systems, and integration with life safety systems. The role ensures compliance with NFPA codes, local regulations, and corporate standards while maintaining a safe environment for semiconductor manufacturing operations. Essential Duties and Responsibilities: Collaborate with fire protection design consultants to ensure system requirements and specifications are met Review fire protection drawings, submittals, and monitor construction progress Support commissioning activities, including functional testing and system validation Identify and resolve abnormalities during construction and start-up phases Manage documentation, manuals, and handover processes for fire protection systems Provide operational and maintenance support for fire suppression systems, alarms, and emergency response systems Ensure compliance with NFPA codes, local fire regulations, and corporate safety standards Perform system capacity planning, troubleshooting, and sustaining activities to meet facility requirements Partner with operations and maintenance teams to optimize fire protection system performance Conduct system evaluations and implement improvements through capital and expense projects Maintain accurate documentation for operational and maintenance procedures Support fire safety audits, inspections, and emergency drills Provide on-call support in a 24/7 high-volume manufacturing environment Required Qualifications: Bachelor’s degree in Fire Protection Engineering, Mechanical Engineering, or related field 3+ years of experience in fire protection system design and operations, preferably in semiconductor or high-tech manufacturing Strong understanding of NFPA codes, fire suppression systems, and life safety standards Ability to read and interpret fire protection drawings and specifications Familiarity with Fire Alarm systems, sprinkler systems, and alarm integration Proficiency in AutoCAD, MS Office, and Bluebeam Strong analytical, decision-making, and troubleshooting skills Experience in semiconductor facility design, construction, commissioning, and start-up Professional Engineering License (PE) or NICET Fire Protection Certification is a plus Knowledge of ISO standards and emergency response planning Physical Requirements: Ability to work in various weather conditions and awkward positions Regularly lift up to 50 lbs. and adjust heavy objects Exposure to sharp, hot, and cold equipment Must be medically qualified to wear a respirator Ability to climb ladders, work at elevation, and in confined spaces with PPE Location: This position will be based at the Arizona Tempe and Peoria sites during the Construction phase and will transition to Peoria for management during the Factory Operation phase. 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        "bodyText": "English 한국어 日本語 简体中文 Document Library Factory Certs Investors Cloud Services Careers Contact Us MENU About Us Amkor Overview Mission Company History Leadership Careers China France Germany Japan Korea Malaysia Philippines Portugal Singapore Taiwan United States Vietnam Smart Manufacturing (I4.0) Corporate Responsibility News Blog Press Releases Events Customer Center Amkor Mechanical Samples B2B Integration Services Cloud Services Document Library Investors Memberships and Partnerships Contact Us Packaging Laminate CABGA/FBGA DSMBGA FCBGA fcCSP FlipStack ® CSP Interposer PoP PBGA/TEPBGA Stacked CSP Leadframe ePad LQFP/TQFP ePad TSSOP/SOIC/SSOP fcMLF ® LQFP Micro LeadFrame ® SOIC SSOP/QSOP TQFP TSSOP/MSOP Memory MEMS and Sensors Power D2PAK (TO-263) DPAK (TO-252) HSON8 LFPAK56 PowerCSP™ PQFN PSMC SO8-FL SOD123-FL SOD128-FL TO-220FP TOLL TSON8-FL System in Package (SiP) Wafer Level WLCSP WLFO/WLCSP+ WLSiP/WL3D Technology 2.5D/3D TSV 3D Stacked Die AiP/AoP Chip-on-Chip Copper Pillar Edge Protection™ Flip Chip Interconnect Optical Sensors Package-on-Package S-Connect™ S-SWIFT™ SWIFT ® Test Services Services Design Services Package Characterization Wafer Bumping Applications Artificial Intelligence Automotive Communications Computing Consumer Industrial Internet of Things Networking Quality Amkor Applicant Privacy Notice Effective: August 2025 Introduction Amkor Technology, Inc. and its subsidiaries (collectively, “Amkor,” “our,” “us,” or “we”) are committed to protecting your personal information and to handling it with transparency. This Applicant Privacy Notice is designed to help you understand how we collect, use, share, and protect your personal information when you apply to work with us. Personal Information We Collect We collect personal information in a variety of ways throughout the recruitment process. This may include information you provide to us directly, information generated by us, and information we receive from third parties. Information You Provide to Us You may share personal information when you apply to work with us as an employee, contractor, intern, or temporary worker, whether you apply through our website, a recruitment platform, or other channel. This information may include: Contact Information – Name, email address, telephone number, and street address. Application Details – Information and documents related to your application, including employment and education history, licenses and certifications, language skills, assessments, professional memberships, resume/CV, cover letter, references, and letters of recommendation. Demographic Information – Date of birth, age, gender, marital status, race and ethnicity, military service and veteran status, work authorization, nationality, citizenship, and government identification numbers. Travel, Interview, and Visit Information – Information necessary to conduct interviews and facilitate onsite visits, including travel-related identifiers and preferences, smock and shoe size, images, video, and other information collected during interactions with us. Health and Safety Data – Disability status, work restrictions, accommodation requests, and health screenings. Information We Generate We may generate personal information during the recruitment process. This information may include: Interview and Screening Data – Information created by us during interviews, assessments, and the review of your application, including notes, evaluations, and scores. Information We Receive from Third Parties We may also receive personal information about you from third parties, including: Background Information – Publicly available information, such as professional profiles from corporate websites, social media platforms, or other online sources. Assessment and Screening Data – Where permitted by law, information related to employment and education verification, criminal history, driving record, and drug screening results. Information from Authorized Third Parties – Personal information shared with us by third parties at your direction or with your authorization, such as references, recruitment agencies, former employers, and educational institutions. How We Use Personal Information We use your personal information for the following purposes: To Evaluate You – We use your personal information to assess your skills and experience and to determine your qualifications and suitability for current and future roles. To Communicate with You – We use your personal information to respond to inquiries, update you about your application, and provide information regarding next steps. To Conduct Interviews, Assessments, and Screenings – We use your personal information to schedule and conduct interviews, administer assessments, and facilitate background and reference checks. To Make Hiring Decisions – We use your personal information to make decisions regarding your candidacy, prepare offer materials, and support onboarding activities. To Establish and Maintain Records – We use your personal information to create and maintain records related to your application, and if hired, to establish and manage your employment record. To Comply with Our Legal Obligations – We process personal information as necessary to meet our legal obligations, including maintaining records for tax and audit purposes and responding to lawful access requests from authorities. To Enforce Our Rights and Resolve Disputes – We may use your personal information to enforce our agreements, manage disputes, respond to claims, and protect our rights. Our Legal Basis for Using Personal Information We use your personal information only when we have a legal basis to do so. These legal bases include: To Fulfill a Contract – We may process your personal information to carry out a contract with you, or to take steps at your request before entering into a contract. To Comply with Our Legal Obligations – We process personal information to meet our legal obligations. To Pursue Our Legitimate Interests – We may use your personal information to support our business, where doing so serves a legitimate interest and is not overridden by your rights and freedoms. To Protect Vital Interests – In limited circumstances, we may use your personal information to help protect your life or the life of another individual. With Your Consent – We may ask for your permission to process your personal information for specific purposes not described in this notice. You may withdraw your consent at any time, as permitted by applicable law, by contacting us at privacy@amkor.com . This will not affect the lawfulness of any processing carried out prior to such withdrawal. How We Share Personal Information We may share your personal information with our corporate group of companies, business partners that provide services or support our operations, and public or regulatory authorities. We share personal information only for the purposes described in this notice. When we share personal information, we take appropriate measures to help ensure it is protected and handled in accordance with applicable data protection laws. Some of the parties with whom we share personal information may be located outside the country where you live. When personal information is transferred to another country, we implement appropriate safeguards to help ensure it remains adequately protected. These safeguards include lawful transfer mechanisms recognized under applicable data protection laws, such as Standard Contractual Clauses (SCCs), adequacy decisions, and consent. If you would like more information about these safeguards or to request a copy of the relevant documentation, you may contact us at privacy@amkor.com . How We Protect Personal Information We implement appropriate administrative, technical, and physical controls to protect your personal information from unauthorized access and disclosure, and accidental loss, modification, and destruction. These measures include data governance policies, data encryption, and access controls that protect our facilities, systems, and data. We also provide our employees with regular security training and require our service providers to meet our security standards. When handling sensitive personal information, we take additional precautions to protect it, such as enforcing role-based access controls, requiring multi-factor authentication, and maintaining activity logs to help detect and respond to potential threats. How Long We Keep Personal Information We retain personal information only as long as necessary to fulfill the purposes described in this notice. When personal information is no longer needed for these purposes, or if there is no longer a valid legal basis for its retention, we will securely and permanently delete it or, where appropriate, anonymize it so that it cannot be used to identify an individual. In accordance with our data retention policy, when determining whether to keep personal information for our legitimate interests, we consider factors such as the nature and sensitivity of the data, the potential risk of harm from unauthorized use or disclosure, the purposes for processing, and whether those purposes can be achieved through other means. For successful candidates, we retain personal information for the duration of their employment and for up to seven years thereafter. For unsuccessful candidates, we retain personal information for up to three years. Your Privacy Rights You may have certain rights under data protection laws in the country where you live, including the right to: Request access. Request correction or deletion. Object to or restrict the processing of your personal information. Request a copy of your personal information in a portable format. Withdraw your consent at any time, where processing is based on consent. File a complaint with a supervisory authority in the country where you live, work, or where you believe your rights have been violated. To exercise your rights, you or your authorized agent may submit a request through our Privacy Request Form or contact us at privacy@amkor.com . Changes to this Applicant Privacy Notice We may update this notice from time to time to reflect changes in our data processing activities, legal obligations, and business operations. We encourage you to review this notice periodically to stay informed about how we collect, use, share, and protect your personal information. To request access to previous versions of this notice, please contact us at privacy@amkor.com . Contact Information Amkor Technology, Inc. is the Controller, or legal entity responsible for your personal information, meaning it determines how and why your personal information is processed. If you have any questions or concerns about this notice or about how your personal information is handled, please contact: Amkor Technology, Inc. Attn: Data Protection Officer 2045 East Innovation Circle Tempe, Arizona 85284 United States Email: privacy@amkor.com If you are applying for a position with a different Amkor company, that entity may also act as a Controller of your personal information. For the name and contact information of these local Controllers, please visit the Contact Us page on our website. Privacy Information for California Applicants For individuals residing in California, the California Consumer Privacy Act (CCPA) and California Privacy Rights Act (CPRA) govern the processing of your personal information. We do not “sell” personal information as the term is defined under CCPA. Your privacy rights under CCPA and CPRA include the right to: Know what personal information we collect, use, and share. You have the right to request that we disclose what personal information we have collected, used, or shared for the preceding 12 months, and why we collected, used, or shared that information. Request correction or deletion. Opt out of the sale or sharing of your personal information. Limit the use or sharing of sensitive personal information. To exercise your rights, you may submit a Verifiable Consumer Request (VCR) using our Privacy Request Form or contact us at privacy@amkor.com . We will not discriminate against you for exercising your rights. Connect with us Sign up for email updates from Amkor © Copyright 2026 Amkor Technology ADA Accessibility | Careers | Privacy Notice | Privacy Request | Legal | Sitemap | Contact Us |",
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        "bodyText": "Amkor Completes NANIUM Aquisition With the acquisition of NANIUM, Amkor will have an equally compelling value proposition in the low-density fan-out area. NANIUM is widely viewed as the fan-out technology leader as well as a very capable manufacturer, having shipped more than one billion WLFO packages utilizing a state-of-the-art 300mm wafer-level packaging production line. The acquisition of NANIUM will strengthen Amkor’s position in the fast growing market of wafer-level packaging for smartphones, tablets & other applications. NANIUM is based near Porto, Portugal, with offices in Germany & USA. More... SiP Packaging Solutions By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing. More... Stay Up to Date on Amkor Technology via Email and Social Media Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at. Stay connected to Amkor by subscribing to our email list or following us on our social media profiles Linkedin , Facebook , Twitter , Google+ and YouTube . More... Press Releases 10/30/17 Amkor Technology Reports Financial Results for the Third Quarter 2017 10/23/17 Amkor Technology to Announce Third Quarter 2017 Financial Results on October 30, 2017 09/26/17 Amkor Technology to Present at Deutsche Bank’s Leveraged Finance Conference 08/31/17 Amkor Technology to Present at Upcoming Conferences More... Data Sheets Datasheet Type: Select Datasheet:   Upcoming Events 11/14/17 SEMICON Europa 11/20/17 IEEE CPMT Symposium Japan 2017 11/28/17 SemIsrael Expo 2017 11/30/17 MEPTEC 2017 Semiconductor Packaging Symposium 12/05/17 3D ASIP Conference Recent Site Updates   2017 Product Line Card - July Update   \"A Practical Approach to Test Through Silicon Vias (TSV)\" White Paper   J-Devices TS-16949 Certificates   \"Through Silicon Via (TSV) Packaging for Improved Performance\" White Paper   ATK TS-16949 Certificate   \"SWIFT® Packaging for Highly Integrated Products\" White Paper   PSMC Data Sheet   Chip-on-Chip POSSUM™ Technology Data Sheet   Amkor Article in CSR May/June Issue, \"What is Driving Advanced Packaging Platforms Development?\" Technical Article   SWIFT® Technology Sheet Copyright © 2003 - 2017 Amkor Technology - 2045 East Innovation Circle Tempe, AZ 85284, (480) 821-5000 Privacy Policy Legal",
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        "bodyText": "MEMS & Sensor Packaging Solutions Amkor Technology is the world's leader in MEMS packaging technologies and the world’s largest outsource provider of MEMS and Sensors. Amkor offers a variety of modeling and characterization expertise to complement a proven high volume manufacturing (HVM) capability. This combination uniquely positions Amkor to assist customers quickly through the development phase and into HVM with new applications. Amkor currently has MEMS & Sensor manufacturing in our Korea, Taiwan and Philippines factories. More... SiP Packaging Solutions By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing. More... Stay Up to Date on Amkor Technology via Email and Social Media Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at. Stay connected to Amkor by subscribing to our email list or following us on our social media profiles Linkedin , Facebook , Twitter , Google+ and YouTube . More... Press Releases 02/02/17 Amkor Technology to Acquire NANIUM 12/14/16 Amkor Completes Product Qualification of SWIFT™ Packaging for Advanced Mobile, Networking and SiP Applications 11/03/16 Amkor Technology to Present at Upcoming Conferences 10/31/16 Amkor Technology Reports Financial Results for the Third Quarter 2016 More... Data Sheets Datasheet Type: Select Datasheet:   Upcoming Events 02/08/17 SEMICON Korea 2017 03/06/17 13th International Conference and Exhibition on Device Packaging 03/22/17 China International Automotive Electronics Technology Expo 2017 06/27/17 MEMS World Summit 2017 Recent Site Updates   \"Through Silicon Via (TSV) Packaging for Improved Performance\" White Paper   ATK TS-16949 Certificate   \"SWIFT™ Packaging for Highly Integrated Products\" White Paper   PSMC Data Sheet   Chip-on-Chip POSSUM™ Technology Data Sheet   SOT-23/TSOT Data Sheet   SO8-FL Data Sheet   2016 Product Line Card - July Update   Amkor Article in CSR May/June Issue, \"What is Driving Advanced Packaging Platforms Development?\" Technical Article   Amkor Article in CSR March/April Issue, \"The Internet of Things and MEMS Packaging\" Technical Article   SWIFT™ Technology Sheet   SLIM™ Technology Sheet Copyright © 2003 - 2017 Amkor Technology - 2045 East Innovation Circle Tempe, AZ 85284, (480) 821-5000 Privacy Policy Legal",
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        "bodyText": "MEMS & Sensor Packaging Solutions Amkor Technology is the world's leader in MEMS packaging technologies and the world’s largest outsource provider of MEMS and Sensors. Amkor offers a variety of modeling and characterization expertise to complement a proven high volume manufacturing (HVM) capability. This combination uniquely positions Amkor to assist customers quickly through the development phase and into HVM with new applications. Amkor currently has MEMS & Sensor manufacturing in our Korea, Taiwan and Philippines factories. More... SiP Packaging Solutions By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing. More... Stay Up to Date on Amkor Technology via Email and Social Media Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at. Stay connected to Amkor by subscribing to our email list or following us on our social media profiles Linkedin , Facebook , Twitter , Google+ and YouTube . More... Press Releases 08/01/16 Amkor Technology Reports Financial Results for the Second Quarter 2016 07/26/16 Amkor Technology to Announce Second Quarter 2016 Financial Results on August 1, 2016 06/28/16 Amkor Technology Opens MEMS Packaging Line in China 06/21/16 Amkor Technology Receives Qualcomm Technologies’ 2015 Supplier of the Year Award More... Data Sheets Datasheet Type: Select Datasheet:   Upcoming Events 09/13/16 ESTC 2016 Conference 09/15/16 European MEMS Summit 2016 09/22/16 The 3rd Global Sensor Summit & China IoT Application Summit 10/10/16 IMAPS 2016 - Pasadena 10/18/16 IWPLC 2016 Recent Site Updates   SO8-FL Data Sheet   2016 Product Line Card - July Update   Amkor Article in CSR May/June Issue, \"What is Driving Advanced Packaging Platforms Development?\" Technical Article   Amkor Article in CSR March/April Issue, \"The Internet of Things and MEMS Packaging\" Technical Article   SWIFT™ Technology Sheet   SLIM™ Technology Sheet   SiP Technology Solution Data Sheet   WLCSP Data Sheet   Stacked CSP (SCSP) Data Sheet   SiP Technology Solution Sheet - Chinese Version   MEMS/Sensor Technology Data Sheet - Chinese Version Copyright © 2003 - 2016 Amkor Technology - 2045 East Innovation Circle Tempe, AZ 85284, (480) 821-5000 Privacy Policy Legal",
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        "bodyText": "System in Package (SiP) Solutions Industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package solutions. Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. With more than 1 billion SiP devices assembled and tested over more than 10 years, Amkor Technology has a proven track record as the industry leader in SiP assembly technology. Contact us today and let us add you to our growing list of customers who have been successful SiP technology. More... Wafer Level Packaging Solutions Amkor offers Wafer Level CSP (WLCSP) to form solder bumps on device I/O pads or to add a copper redistribution layer and route from I/O pads to solder bumps on JEDEC / EIAJ standard pitches. WLCSP is a true chip-scale package, offering the smallest possible footprint. Amkor provides wafer bumping , wafer level test , back grind, dicing, and packing in tape & reel to support a full turn-key WLCSP solution. Amkor is able to integrate its wafer bumping products into high performance packaging options, such as Flip Chip CSP & System in Package (SiP) . More... Flip Chip Interconnect Packaging Solutions Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. SuperFC ®, fcBGA, fcLBGA, FCmBGA , fcCSP and FlipStack CSP are qualified and are in production. More... Press Releases 05/07/14 Amkor Technology to Present at Barclays High Yield Bond and Syndicated Loan Conference 05/02/14 Amkor Technology Announces Presentation Time Change at Jefferies TMT Conference 04/29/14 Amkor Technology to Present at Jefferies TMT Conference 04/28/14 Amkor Technology Reports Financial Results for the First Quarter 2014 More... Data Sheets Datasheet Type: Select Datasheet:   Upcoming Events 05/22/14 12th Annual MEPTEC MEMS Technology Symposium 05/27/14 ECTC 2014 05/29/14 TSMC 2014 Taiwan Technology Symposium Ecosystem Pavilion 06/22/14 The ConFab 2014 09/10/14 GSA US Executive Forum Recent Site Updates   Taiwan Location Fact Sheet   China Location Fact Sheet   Philippines Location Fact Sheet   System-in-Package (SiP) Technology Solution Data Sheet   Amkor Article in the GSA Forum July Newsletter titled, \"Embedded Die Packaging Technologies Enable Innovative 2D and 3D Structures for Portable Applications\" Technical Article   PSOP 3 Data Sheet   \"Enhancing Overall System Functionality and Performance with the Right Packaging Solutions\", White Paper   SOT / TSOT / SC Data Sheet   Test Services Datasheet Copyright © 2003 - 2014 Amkor Technology - 1900 South Price Road, Chandler AZ USA 85286, (480) 821-5000 Privacy Policy Legal",
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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Board of Directors Corporate Management Legal Factory Certifications Manufacturing & Test Facilities Memberships & Associations Privacy Policy Yes, We Do That! Search for: on Amkor.com Info Request What's New Amkor > About Amkor Leading the Industry in Outsourcing Semiconductor Assembly and Test Digital cameras. Cell phones. Network servers. Laptops. Video games. MP3 players. When Amkor Technology was founded in 1968, many of the products that we take for granted today existed only in the mind's eye of visionaries. Amkor helped make these visions a reality by pioneering the outsourcing of semiconductor assembly and test services. Today, Amkor is a strategic contract manufacturing resource for many of the world's leading semiconductor companies. We have developed unique expertise in high-volume manufacturing techniques and have diversified and expanded our operational scope by establishing production centers in strategic locations throughout Asia. Amkor provides leading-edge package solutions such as Stacked Packaging , Flip Chip , Micro LeadFrame ® , System-in-Package , MEMS , Wafer Level Packaging (WLP), CMOS Image Sensor Camera Modules , and Game, Memory and I/O Cards (AmkKard ® ) for latest generation applications. Amkor supplements its world-class operational scope with the industry's Largest package design staff Broadest portfolio of packaging technology Deepest sales and support organization As integrated circuits increase in speed and complexity, the right semiconductor packaging becomes critical to ensure optimal system performance. Amkor is an industry leader in tailoring application-specific package design, assembly and test solutions. Amkor offers the industry's broadest array of package formats and sizes, from traditional, \"off-the-shelf\" leadframe configurations to leading-edge chip scale, flip chip and system-in-package solutions incorporating highly customized designs. This allows Amkor to be a single source for many of our customers' total IC packaging requirements. We also provide a complete range of test engineering services for RF , mixed signal, logic and memory devices, from test program development to full product characterization. Amkor is a major provider of RF test services and is the world leader in Strip Test , an innovative, highly parallel test solution that offers customers low cost, faster index time and improved test yields. Collaboration: Speeding Time-to-Revenue With Amkor providing turnkey solutions that include semiconductor design , packaging, test and drop-shipment services, our customers can get accelerate time-to-revenue for their new products. Amkor collaborates with customers and leading OEMs to develop comprehensive package solutions that make it easier for next-generation semiconductors to be designed into next-generation end products. By sharing device, package and product roadmaps we enable our customers - and their customers - to accelerate the development and deployment of new microelectronic applications. Focusing on our core competencies allows our customers to optimize their assets and reduce time-to-sales. The Industry's Broadest Reach Amkor has more than five million square feet of manufacturing space in factories strategically located in key microelectronic manufacturing centers throughout Asia. Our customers benefit from the industry's most extensive operational footprint, which enables us to easily handle large orders and quick turnaround times. All manufacturing sites worldwide are working towards, or have received certification to QS-9000, ISO-9001, ISO-9002, ISO-14001, ISO-14000, IECQ, and DSCC / QML. Amkor factories are strategically located in the heart of Asia's microelectronic manufacturing centers such as China , Japan, Korea, Philippines, and Taiwan. Amkor Technology Videos (Videos may take a moment to load) Amkor Corporate Video 7.4 MB Amkor Wafer Bumping Video 8.5 MB Additional Information: Description File Type File Size   Amkor Technology Corporate Brochure 636 kb   Amkor Technology Corporate Brochure   (Japanese Translation) 803 kb   Amkor Technology Corporate Fact Sheet 336 kb   Amkor Sales, Factory and Customer Service   Contact Information Directory 38 kb Home | About Amkor | Products | Services | Enabling Technologies | Customer Center | News Investors | Employment | Contact Information | Legal | Privacy Policy Copyright 1996 - 2008 Amkor Technology, Inc. All Rights Reserved.",
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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Board of Directors Corporate Management Legal Factory Certifications Manufacturing & Test Facilities Memberships & Associations Privacy Policy Yes, We Do That! Search for: on Amkor.com Info Request What's New Amkor > About Amkor > Amkor Technology Memberships and Associations Amkor Technology Memberships and Associations The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. http://www.gsaglobal.org Advance Packaging & Interconnect Alliance - ( APiA ) organization develops comprehensive risk-free advanced interconnect solutions. Provides a single source for the advanced packaging & interconnect industries. Guarantees equipment availability and compatibility with bump and wafer level CSP processes. And provides 300mm Bump and Wafer Level CSP prototyping services. http://www.apialliance.com International Wireless Packaging Consortium - ( IWPC ) The Consortium is a pro-active organization of WIRELESS AND RF PRODUCT OEM’s and their suppliers with an emphasis on packaging and interconnect technologies. Suppliers are able to efficiently learn about the technical and business needs of wireless & RF OEM's so they can make the appropriate development investments. OEM's are able to efficiently learn of the developments of suppliers so they can consider these developments on their product development roadmaps. http://www.iwpc.org Joint Electron Device Engineering Council - ( JEDEC ) is the semiconductor engineering standardization body of the Electronic Industries Alliance (EIA). JEDEC has been the foremost standards development organization for the semiconductor industry since 1958. JEDEC develops standards through its 48 Committees / Subcommittees overseen by the JEDEC Solid State Technology Association Board of Directors. http://www.jedec.org Japan Electronics and Information Technology Industries Association - ( JEITA ) was formed on November 1, 2000, when the Electronic Industries Association of Japan (EIAJ) and Japan Electronic Industries Development Association (JEIDA) merged. JEITA is a new industry organization in Japan with activities covering both the electronics and information technology (IT) fields. http://www.jeita.or.jp/ Microelectronics Packaging and Test Engineering Council - ( MEPTEC ) is a trade association of semiconductor suppliers and manufacturers, committed to enhancing the competitiveness of the back-end portion of the semiconductor business. Since its inception over 25 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to assembly, test and handling. http://www.meptec.org MultiMediaCard Association (MMCA) - was founded in 1998, with 14 companies as original members, to promote the worldwide adoption of these sleek, slim, small and secure devices. The MMCA standard grew out of a joint development between SanDisk Corporation, Siemens AG and Infineon Technologies AG, and was introduced in July 1995.   The MMCA grew rapidly and now has over 200 member companies worldwide, representing all branches of mobile electronic applications, including semiconductor suppliers, software vendors, and manufacturers of products such as mobile phones, digital cameras, personal digital assistants (PDAs) and more. http://www.mmca.org RosettaNet - is a non-profit consortium of Information Technology, Electronic Components, and Semiconductor Manufacturing companies collaborating to initiate industry-wide e-business process standards. These standards serve to align processes between supply chain partners on a global basis. http://www.rosettanet.org/ United States - Taiwan Business Council - The US - Taiwan Business Council serves as a portal to Taiwan, as our network of relationships gives our members access to people and information to help them succeed in their Taiwan endeavors. Serving as an effective representative in dealing with business, trade, and investment matters, the Council comprises a large network of companies involved in business between Taiwan and the United States. http://www.us-taiwan.org/ Semiconductor Equipment Consortium for Advanced Packaging - ( SECAP ) The mission of SECAP is to support the advanced packaging industry by delivering optimized process equipment for wafer bumping, wafer level packaging and HDI technology. The membership of SECAP is limited to equipment and material suppliers in order to maintain SECAP as an efficient and trustworthy resource to the advanced packaging industry. http://www.secap.org SecureDigital Card Association - ( SDA ) The association aims to establish the technical and specification standards for SD Memory Card applications, to continuously promote the SD memory card as the de-facto industry standard, and to encourage the development of digital A/V, wireless communication, and digital networking products that utilize the many unique benefits of SD technology. http://www.sdcard.org SIM Alliance - SIMalliance is a non-profit organization created to promote the benefits of SIM Cards and SIM-Based services. SIMalliance promotes key functionalities and usages of the SIM Card that help energize the new generation of mobile services. The major achievements include proposing enhancements and providing support to standards and interoperable products surrounding mobile internet and open platform technologies. http://www.simalliance.org/ USB Implementers Forum - is a non-profit corporation founded by the group of companies that developed the Universal Serial Bus specification. The USB-IF was formed to provide a support organization and forum for the advancement and adoption of Universal Serial Bus technology. The Forum facilitates the development of high-quality compatible USB peripherals (devices), and promotes the benefits of USB and the quality of products that have passed compliance testing. http://www.usb.org Home | About Amkor | Products | Services | Enabling Technologies | Customer Center | News Investors | Employment | Contact Information | Legal | Privacy Policy Copyright 1996 - 2008 Amkor Technology, Inc. All Rights Reserved.",
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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Board of Directors Corporate Management Legal Factory Certifications Manufacturing & Test Facilities Memberships & Associations Privacy Policy Yes, We Do That! Search for: on Amkor.com Info Request What's New Amkor > About Amkor > Privacy Policy Amkor Technology Privacy Policy Overview Amkor Technology is committed to respecting your privacy. In general, you can visit www.amkor.com without revealing any personal information about yourself. Amkor Technology does collect information regarding visitors to our web site, such as domain name, number of visits, time spent, product and service datasheets downloaded, and what pages were viewed. We do this to measure use and improve the content of our site. We analyze this data for trends and statistics. We also share this information within Amkor to enable us to better understand our customer's product and service needs, in return creating a better end product and service that fits your increasing demand. Personal Information There are times, however, when we may request information from you, such as your name, address and e-mail address. When additional information is requested, we will try to let you know at the time of collection how we intend to use the personal information you provide, such as respond to your inquiry, participate in certain promotions, conduct a survey or allow you to access specific information. If you sign up for an Amkor Technology email list (Press Releases, Product Rollouts, Investor Info, etc.), each message will include instructions on how to \"unsubscribe\" from that list. We respect your right to choose whether to give us personal information or \"opt out\" if you do not wish to disclose personal information. We do our best to maintain the accuracy of any personal information you do supply to us. Any information provided by you will be used for Amkor Technology's purposes only. Your information will not be shared with other individuals or companies unless required by law. However, Amkor Technology may need to provide your name and delivery address to third parties that Amkor Technology uses for delivering specific services to you. Our Web sites may provide links to third party sites. Since we do not control those Web sites, we encourage you to review the privacy policies of these third party sites. Security This site has security measures in place to protect the loss, misuse and alteration of the information under our control. We utilize 128 bit Secure Sockets Layer (SSL) whenever necessary to encrypt sensitive information. If your browser does not support 128 bit encryption, our servers are capable of negotiating 40 bit SSL as well. Amkor Technology is committed to taking reasonable steps to protect the individual identifying information that you provide. You can help Amkor Technology update and maintain the accuracy of any personal information you supply by notifying Amkor Technology of any changes to your address, title, phone number or e-mail address. Questions or Comments If you have any questions about this privacy statement, the practices of this site, or your dealings with this Web site, you may contact webmaster@amkor.com . Home | About Amkor | Products | Services | Enabling Technologies | Customer Center | News Investors | Employment | Contact Information | Legal | Privacy Policy Copyright 1996 - 2008 Amkor Technology, Inc. All Rights Reserved.",
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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Board of Directors Corporate Management Legal Factory Certifications Manufacturing & Test Facilities Memberships & Associations Privacy Policy Yes, We Do That! Search for: on Amkor.com Info Request What's New Amkor > About Amkor > Legal Legal Information Disclaimer THE MATERIALS ON THIS SITE ARE PROVIDED \"AS IS\" WITHOUT WARRANTY, EITHER EXPRESS OR IMPLIED INCLUDING WARRANTIES OF MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE OR USE, OR NONINFRINGEMENT OF INTELLECTUAL PROPERTY. AMKOR DOES NOT WARRANTY OR MAKE ANY REPRESENTATIONS REGARDING THE USE, VALIDITY, ACCURACY OR RELIABILITY OF THE MATERIALS INCLUDING TEXT, IMAGES, LINKS, OR OTHER ITEMS ON THIS SITE OR OTHER SITES LINKED TO THIS SITE. UNDER NO CIRCUMSTANCES SHALL AMKOR, ITS SUPPLIERS, OR PARTNERS BE LIABLE FOR ANY DAMAGES WHATSOEVER (INCLUDING BUT NOT LIMITED TO DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, LOSS OF INFORMATION) ARISING OUT OF THE USE OF OR INABILITY TO USE THE MATERIALS ON THIS SITE, EVEN IF AMKOR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. SOME JURISDICTIONS DO NOT ALLOW THE EXCLUSION OR LIMITATION OF LIABILITY FOR INCIDENTAL OR CONSEQUENTIAL DAMAGES, SO THE ABOVE LIMITATION MAY NOT APPLY TO YOU. THE INFORMATION PUBLISHED ON THIS WEB SITE COULD INCLUDE TECHNICAL INACCURACIES OR TYPOGRAPHICAL ERRORS. CHANGES ARE PERIODICALLY MADE TO THE INFORMATION CONTAINED ON THIS SITE. AMKOR, ITS SUPPLIERS, AND ITS PARTNERS MAY MAKE IMPROVEMENTS AND/OR CHANGES TO THE WEB SITE DESCRIBED HEREIN AT ANY TIME. Applicable Laws This Web site is housed and maintained by Amkor from its offices within the United States of America. Amkor makes no representation that materials on the site are appropriate or available for use in other locations and jurisdictions, and access to them from locations where their contents are illegal is prohibited. Those accessing this site from locations outside the United States of America do so on their own initiative and are responsible for complying with applicable local laws. Any claim relating to or concerning the materials on this site shall be governed by the laws of the State of Delaware. Links to Outside Sites Amkor's Web site may contain links to outside sites. These links are provided as a courtesy to our consumers and in no way imply endorsement by Amkor. Amkor is in no way responsible for the content of any site linked to from the Amkor Web site. Trademarks The Amkor Technology logo is a registered trademark of Amkor. Other Amkor trademarks are referenced herin. Other products, logos, and company names mentioned herein may be the trademarks or registered trademarks of their respective owners. Home | About Amkor | Products | Services | Enabling Technologies | Customer Center | News Investors | Employment | Contact Information | Legal | Privacy Policy Copyright 1996 - 2008 Amkor Technology, Inc. All Rights Reserved.",
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        "title": "Amkor Technology: Microelectronic Assembly and Test - Yes, We do that!",
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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Board of Directors Corporate Management Legal Factory Certifications Manufacturing & Test Facilities Memberships & Associations Privacy Policy Yes, We Do That! Search for: on Amkor.com Info Request What's New Amkor > About Amkor > Microelectronic Assembly and Test - Yes, We Do That! Microelectronic Assembly and Test - Yes We Do That! Technology Leadership with Cost Effective High-Volume Manufacturing Amkor is one of the world's largest providers of semiconductor assembly and test services. Each year we package billions of semiconductor chips, representing approximately 7% of the world's IC packaging requirements. In addition to producing some of the highest volume, lowest cost traditional microelectronic packages, Amkor is a leader in the latest packaging technology, enabling our customers to produce their products to meet today’s market demands. Micro LeadFrame ® (MLF ® ) Amkor's Micro LeadFrame ® packages provide a cost-effective answer to the demand for small size and high-performance integrity in a cost-effective leadframe package, including exceptional RF and thermal management characteristics, enabling greater capability in smaller spaces for portable devices. Wafer Bumping / Wafer Level Packaging / Flip Chip Technology Amkor is a leader in wafer-bumping technology for silicon and smaller, high-speed applications. Amkor's flip chip solutions for high bandwidth and wireless / RF applications improve signal integrity, performance and reduce costs for highest performance ASICs. Flip chip interconnection improves signal integrity by significantly decreasing inductance and improving impedance. This allows direct power routing to the center of the die, decreasing the power and ground loop inductance and utilizing the entire die. The design permits die shrinks that translate into significant silicon cost savings and smaller package footprint. Through our acquisition of Unitive ® , Amkor now offers the world’s leading technology for electroplated wafer bumping of 200 mm and 300 mm wafers . Stacked and 3D Innovative end use products challenge IC package-mounted height requirements to new extremes. Amkor provides extremely thin single-chip and 3D packaging technologies that enable a range of emerging applications requiring highly-integrated solutions. Amkor's enabling technologies in thin or 3D package platforms provide ongoing advancements in package form factor, electrical, thermal and reliability, allowing 2x to 3x density in the same footprint. System in Package (SiP) Amkor's SiP module , consisting of multiple semiconductor chips and passive circuit elements in a modified conventional IC package, is perfect for the expanding integration needs of a cost-sensitive market. SiPs are an ideal solution for high-speed switches, memory modules and wireless applications. Amkor offers a full service SiP approach from design to test. Memory, Game & I/O Cards (AmKard ® ) Amkor has expanded its assembly technology and test capacity to include flash memory cards that achieve higher storage densities. These applications include the use of stacked die to meet the growing market requirements of digital photography and digital audio equipment. Micro-ElectroMechanical Systems (MEMS) Amkor Technology is the world's largest independent packaging provider of microelectromechanical systems ( MEMS ), micron-sized devices that manipulate the physical world. These extremely small, fast, precise and reliable devices are most commonly used in optical switching, medical and transportation devices, airbag sensors, game controllers and other industrial and consumer products. Lead-Free / Green Packages / Pb-Free / Environmentally Friendly Amkor Technology offers alternative package styles that are environmentally friendly, including lead-free and green packaging that maintain performance, reliability and high-quality standards. Amkor offers green packaging in laminate and leadframe packages. RF and Other Test Services The explosive demand for wireless and RF devices creates a need for test services . Amkor offers complete, end-to-end test solutions and is a leader in RF test . Automated Package Design Amkor uses automated package design tools that ensure your market design-to-production demands are met. Additional Information: Description File Type File Size   Flip Chip Interconnect Technology Solution   Sheet 318 kb   Micro LeadFrame ® Data Sheet 203 kb   Memory, Game & I/O (AmKard ® ) Cards Data   Sheet 282 kb   RF Test Services Data Sheet 181 kb   Stacked CSP Data Sheet 293 kb   System in Package (SiP) - Module   Technology Solution Sheet 92 kb   Test Service Sheet 147 kb   Design Institute Services Sheet 660 kb Home | About Amkor | Products | Services | Enabling Technologies | Customer Center | News Investors | Employment | Contact Information | Legal | Privacy Policy Copyright 1996 - 2008 Amkor Technology, Inc. All Rights Reserved.",
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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Board of Directors Corporate Management Legal Factory Certifications Manufacturing & Test Facilities Memberships & Associations Privacy Policy Yes, We Do That! Search for: on Amkor.com Info Request What's New Amkor > About Amkor > Corporate Management Corporate Management   James J. Kim Chairman and Chief Executive Officer   Oleg Khaykin Executive Vice President and Chief Operating Officer         Kenneth T. Joyce Executive Vice President, Administration and Chief Financial Officer   Jooho Kim   Executive Vice President ICS         Oleg Khaykin   Executive Vice President Corporate Development   Michael J. Lamble   Corporate Vice President Worldwide Sales       Home | About Amkor | Products | Services | Enabling Technologies | Customer Center | News Investors | Employment | Contact Information | Legal | Privacy Policy Copyright 1996 - 2008 Amkor Technology, Inc. All Rights Reserved.",
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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Board of Directors Corporate Management Legal Factory Certifications Manufacturing & Test Facilities Memberships & Associations Privacy Policy Yes, We Do That! Search for: on Amkor.com Info Request What's New Amkor > About Amkor > Board of Directors Board of Directors   James J. Kim Chairman and Chief Executive Officer Amkor Technology, Inc.     Thomas D. George 1 Retired President and General Manager Semiconductor Sector Motorola, Inc.     Winston J. Churchill 1, 2, 3 Chair: Compensation Committee Chairman Churchill Investment Partners, Inc. and CIP Capital, Inc     Gregory K. Hinckley 2 Chief Operating Officer and Chief Financial Officer Mentor Graphics Corporation     James Zug 2 Chair: Audit Committee Retired Senior Partner, PricewaterhouseCoopers, LLP     John B. Neff 2, 3 Retired Senior Vice President and Managing Partner Wellington Management Co.     1 Member Compensation Committee 2 Member Audit Committee 3 Member Nominating & Governance Committee Home | About Amkor | Products | Services | Enabling Technologies | Customer Center | News Investors | Employment | Contact Information | Legal | Privacy Policy Copyright 1996 - 2008 Amkor Technology, Inc. All Rights Reserved.",
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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Board of Directors Corporate Management Legal Factory Certifications Manufacturing & Test Facilities Memberships & Associations Privacy Policy Yes, We Do That! Search for: on Amkor.com Info Request What's New Amkor > About Amkor > Microelectronic Assembly and Test - Yes, We Do That! Microelectronic Assembly and Test - Yes We Do That! Technology Leadership with Cost Effective High-Volume Manufacturing Amkor is one of the world's largest providers of semiconductor assembly and test services. Each year we package billions of semiconductor chips, representing approximately 7% of the world's IC packaging requirements. In addition to producing some of the highest volume, lowest cost traditional microelectronic packages, Amkor is a leader in the latest packaging technology, enabling our customers to produce their products to meet today’s market demands. Micro LeadFrame ® (MLF ® ) Amkor's Micro LeadFrame ® packages provide a cost-effective answer to the demand for small size and high-performance integrity in a cost-effective leadframe package, including exceptional RF and thermal management characteristics, enabling greater capability in smaller spaces for portable devices. Wafer Bumping / Wafer Level Packaging / Flip Chip Technology Amkor is a leader in wafer-bumping technology for silicon and smaller, high-speed applications. Amkor's flip chip solutions for high bandwidth and wireless / RF applications improve signal integrity, performance and reduce costs for highest performance ASICs. Flip chip interconnection improves signal integrity by significantly decreasing inductance and improving impedance. This allows direct power routing to the center of the die, decreasing the power and ground loop inductance and utilizing the entire die. The design permits die shrinks that translate into significant silicon cost savings and smaller package footprint. Through our acquisition of Unitive ® , Amkor now offers the world’s leading technology for electroplated wafer bumping of 200 mm and 300 mm wafers . Stacked and 3D Innovative end use products challenge IC package-mounted height requirements to new extremes. Amkor provides extremely thin single-chip and 3D packaging technologies that enable a range of emerging applications requiring highly-integrated solutions. Amkor's enabling technologies in thin or 3D package platforms provide ongoing advancements in package form factor, electrical, thermal and reliability, allowing 2x to 3x density in the same footprint. System in Package (SiP) Amkor's SiP module , consisting of multiple semiconductor chips and passive circuit elements in a modified conventional IC package, is perfect for the expanding integration needs of a cost-sensitive market. SiPs are an ideal solution for high-speed switches, memory modules and wireless applications. Amkor offers a full service SiP approach from design to test. Memory, Game & I/O Cards (AmKard ® ) Amkor has expanded its assembly technology and test capacity to include flash memory cards that achieve higher storage densities. These applications include the use of stacked die to meet the growing market requirements of digital photography and digital audio equipment. Micro-ElectroMechanical Systems (MEMS) Amkor Technology is the world's largest independent packaging provider of microelectromechanical systems ( MEMS ), micron-sized devices that manipulate the physical world. These extremely small, fast, precise and reliable devices are most commonly used in optical switching, medical and transportation devices, airbag sensors, game controllers and other industrial and consumer products. Lead-Free / Green Packages / Pb-Free / Environmentally Friendly Amkor Technology offers alternative package styles that are environmentally friendly, including lead-free and green packaging that maintain performance, reliability and high-quality standards. Amkor offers green packaging in laminate and leadframe packages. RF and Other Test Services The explosive demand for wireless and RF devices creates a need for test services . Amkor offers complete, end-to-end test solutions and is a leader in RF test . Automated Package Design Amkor uses automated package design tools that ensure your market design-to-production demands are met. 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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Board of Directors Corporate Management Legal Factory Certifications Manufacturing & Test Facilities Memberships & Associations Privacy Policy Yes, We Do That! Search for: on Amkor.com Info Request What's New Amkor > About Amkor > Amkor Technology Memberships and Associations Amkor Technology Memberships and Associations The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. http://www.gsaglobal.org Advance Packaging & Interconnect Alliance - ( APiA ) organization develops comprehensive risk-free advanced interconnect solutions. Provides a single source for the advanced packaging & interconnect industries. Guarantees equipment availability and compatibility with bump and wafer level CSP processes. And provides 300mm Bump and Wafer Level CSP prototyping services. http://www.apialliance.com International Wireless Packaging Consortium - ( IWPC ) The Consortium is a pro-active organization of WIRELESS AND RF PRODUCT OEM’s and their suppliers with an emphasis on packaging and interconnect technologies. Suppliers are able to efficiently learn about the technical and business needs of wireless & RF OEM's so they can make the appropriate development investments. OEM's are able to efficiently learn of the developments of suppliers so they can consider these developments on their product development roadmaps. http://www.iwpc.org Joint Electron Device Engineering Council - ( JEDEC ) is the semiconductor engineering standardization body of the Electronic Industries Alliance (EIA). JEDEC has been the foremost standards development organization for the semiconductor industry since 1958. JEDEC develops standards through its 48 Committees / Subcommittees overseen by the JEDEC Solid State Technology Association Board of Directors. http://www.jedec.org Japan Electronics and Information Technology Industries Association - ( JEITA ) was formed on November 1, 2000, when the Electronic Industries Association of Japan (EIAJ) and Japan Electronic Industries Development Association (JEIDA) merged. JEITA is a new industry organization in Japan with activities covering both the electronics and information technology (IT) fields. http://www.jeita.or.jp/ Microelectronics Packaging and Test Engineering Council - ( MEPTEC ) is a trade association of semiconductor suppliers and manufacturers, committed to enhancing the competitiveness of the back-end portion of the semiconductor business. Since its inception over 25 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to assembly, test and handling. http://www.meptec.org MultiMediaCard Association (MMCA) - was founded in 1998, with 14 companies as original members, to promote the worldwide adoption of these sleek, slim, small and secure devices. The MMCA standard grew out of a joint development between SanDisk Corporation, Siemens AG and Infineon Technologies AG, and was introduced in July 1995.   The MMCA grew rapidly and now has over 200 member companies worldwide, representing all branches of mobile electronic applications, including semiconductor suppliers, software vendors, and manufacturers of products such as mobile phones, digital cameras, personal digital assistants (PDAs) and more. http://www.mmca.org RosettaNet - is a non-profit consortium of Information Technology, Electronic Components, and Semiconductor Manufacturing companies collaborating to initiate industry-wide e-business process standards. These standards serve to align processes between supply chain partners on a global basis. http://www.rosettanet.org/ United States - Taiwan Business Council - The US - Taiwan Business Council serves as a portal to Taiwan, as our network of relationships gives our members access to people and information to help them succeed in their Taiwan endeavors. Serving as an effective representative in dealing with business, trade, and investment matters, the Council comprises a large network of companies involved in business between Taiwan and the United States. http://www.us-taiwan.org/ Semiconductor Equipment Consortium for Advanced Packaging - ( SECAP ) The mission of SECAP is to support the advanced packaging industry by delivering optimized process equipment for wafer bumping, wafer level packaging and HDI technology. The membership of SECAP is limited to equipment and material suppliers in order to maintain SECAP as an efficient and trustworthy resource to the advanced packaging industry. http://www.secap.org SecureDigital Card Association - ( SDA ) The association aims to establish the technical and specification standards for SD Memory Card applications, to continuously promote the SD memory card as the de-facto industry standard, and to encourage the development of digital A/V, wireless communication, and digital networking products that utilize the many unique benefits of SD technology. http://www.sdcard.org SIM Alliance - SIMalliance is a non-profit organization created to promote the benefits of SIM Cards and SIM-Based services. SIMalliance promotes key functionalities and usages of the SIM Card that help energize the new generation of mobile services. The major achievements include proposing enhancements and providing support to standards and interoperable products surrounding mobile internet and open platform technologies. http://www.simalliance.org/ USB Implementers Forum - is a non-profit corporation founded by the group of companies that developed the Universal Serial Bus specification. The USB-IF was formed to provide a support organization and forum for the advancement and adoption of Universal Serial Bus technology. The Forum facilitates the development of high-quality compatible USB peripherals (devices), and promotes the benefits of USB and the quality of products that have passed compliance testing. http://www.usb.org Home | About Amkor | Products | Services | Enabling Technologies | Customer Center | News Investors | Employment | Contact Information | Legal | Privacy Policy Copyright 1996 - 2008 Amkor Technology, Inc. All Rights Reserved.",
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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Board of Directors Corporate Management Legal Factory Certifications Manufacturing & Test Facilities Memberships & Associations Privacy Policy Yes, We Do That! Search for: on Amkor.com Info Request What's New Amkor > About Amkor > Privacy Policy Amkor Technology Privacy Policy Overview Amkor Technology is committed to respecting your privacy. In general, you can visit www.amkor.com without revealing any personal information about yourself. Amkor Technology does collect information regarding visitors to our web site, such as domain name, number of visits, time spent, product and service datasheets downloaded, and what pages were viewed. We do this to measure use and improve the content of our site. We analyze this data for trends and statistics. We also share this information within Amkor to enable us to better understand our customer's product and service needs, in return creating a better end product and service that fits your increasing demand. Personal Information There are times, however, when we may request information from you, such as your name, address and e-mail address. When additional information is requested, we will try to let you know at the time of collection how we intend to use the personal information you provide, such as respond to your inquiry, participate in certain promotions, conduct a survey or allow you to access specific information. If you sign up for an Amkor Technology email list (Press Releases, Product Rollouts, Investor Info, etc.), each message will include instructions on how to \"unsubscribe\" from that list. We respect your right to choose whether to give us personal information or \"opt out\" if you do not wish to disclose personal information. We do our best to maintain the accuracy of any personal information you do supply to us. Any information provided by you will be used for Amkor Technology's purposes only. Your information will not be shared with other individuals or companies unless required by law. However, Amkor Technology may need to provide your name and delivery address to third parties that Amkor Technology uses for delivering specific services to you. Our Web sites may provide links to third party sites. Since we do not control those Web sites, we encourage you to review the privacy policies of these third party sites. Security This site has security measures in place to protect the loss, misuse and alteration of the information under our control. We utilize 128 bit Secure Sockets Layer (SSL) whenever necessary to encrypt sensitive information. If your browser does not support 128 bit encryption, our servers are capable of negotiating 40 bit SSL as well. Amkor Technology is committed to taking reasonable steps to protect the individual identifying information that you provide. You can help Amkor Technology update and maintain the accuracy of any personal information you supply by notifying Amkor Technology of any changes to your address, title, phone number or e-mail address. Questions or Comments If you have any questions about this privacy statement, the practices of this site, or your dealings with this Web site, you may contact webmaster@amkor.com . Home | About Amkor | Products | Services | Enabling Technologies | Customer Center | News Investors | Employment | Contact Information | Legal | Privacy Policy Copyright 1996 - 2008 Amkor Technology, Inc. All Rights Reserved.",
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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Product and Service Data Sheets Search for: on Amkor.com Info Request What's New \"Common Platform Technology: A New Model for Semiconductor Manufacturing\" In-Depth Analysis from In-Stat ( 300 kb PDF ) Amkor Technology Corporate Presentation ( 1.8 MB PDF ) Amkor Corporate Fact Sheet ( 997 kb PDF ) Amkor Reports Second Quarter 2007 Results AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer Level Packaging Amkor Appoints Gil C. Tily General Counsel Amkor Technology Announces Date of Second Quarter Earnings Conference Call Amkor Redeems Its 10.5% Senior Subordinated Notes Due May 01, 2009 Amkor and UTAC Enter Into Cross-License Agreement Wafer Bumping & Die Level Interconnect Services Amkor offers state-of-the-art capability in electroplated solder technologies in multiple strategic locations (Taiwan, Korea, Singapore, and the US). These locations are uniquely situated adjacent to major foundry sources to enable our customers reduced time to market with integrated factory logistics. This combination of technology and manufacturing capabilities is unparalleled in the subcontract manufacturing industry. Click here for additional information. TEPBGA Package Amkor's TEPBGA's feature a drop-in heat spreader and ball counts up to 1521, are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors (silicon). Custom performance enhancements are available for significant improvements in electrical response demanded by advancing electronics. Click here for additional information. TSOP Package Amkor offers a full family of popular TSOP packages to serve the needs of IC designers, PCB / system engineers and component specifiers. Small and thin, with 8 to 80 lead counts, these 1.0 mm body packages were designed and introduced to operate reliably in a variety of environments.Particular attention was focused on material sets and assembly processes to address user issues such as flatness, coplanarity, wire sweep, delamination, solderability and more. Click here for additional information. Home | About Amkor | Products | Services | Enabling Technologies | Customer Center | News Investors | Employment | Contact Information | Legal | Privacy Policy Copyright 1996 - 2007 Amkor Technology, Inc. All Rights Reserved.",
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        "bodyText": "HOME ABOUT AMKOR | PRODUCTS | SERVICES | ENABLING TECHNOLOGIES | CUSTOMER CENTER INVESTORS | NEWS | EMPLOYMENT | CONTACT INFORMATION Board of Directors Corporate Management Legal Factory Certifications Manufacturing & Test Facilities Memberships & Associations Privacy Policy Yes, We Do That! Search for: on Amkor.com Info Request What's New Amkor > About Amkor > Microelectronic Assembly and Test - Yes, We Do That! Microelectronic Assembly and Test - Yes We Do That! Technology Leadership with Cost Effective High-Volume Manufacturing Amkor is one of the world's largest providers of semiconductor assembly and test services. Each year we package billions of semiconductor chips, representing approximately 7% of the world's IC packaging requirements. In addition to producing some of the highest volume, lowest cost traditional microelectronic packages, Amkor is a leader in the latest packaging technology, enabling our customers to produce their products to meet today’s market demands. Micro LeadFrame ® (MLF ® ) Amkor's Micro LeadFrame ® packages provide a cost-effective answer to the demand for small size and high-performance integrity in a cost-effective leadframe package, including exceptional RF and thermal management characteristics, enabling greater capability in smaller spaces for portable devices. Wafer Bumping / Wafer Level Packaging / Flip Chip Technology Amkor is a leader in wafer-bumping technology for silicon and smaller, high-speed applications. Amkor's flip chip solutions for high bandwidth and wireless / RF applications improve signal integrity, performance and reduce costs for highest performance ASICs. 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System in Package (SiP) Amkor's SiP module , consisting of multiple semiconductor chips and passive circuit elements in a modified conventional IC package, is perfect for the expanding integration needs of a cost-sensitive market. SiPs are an ideal solution for high-speed switches, memory modules and wireless applications. Amkor offers a full service SiP approach from design to test. Memory, Game & I/O Cards (AmKard ® ) Amkor has expanded its assembly technology and test capacity to include flash memory cards that achieve higher storage densities. These applications include the use of stacked die to meet the growing market requirements of digital photography and digital audio equipment. Micro-ElectroMechanical Systems (MEMS) Amkor Technology is the world's largest independent packaging provider of microelectromechanical systems ( MEMS ), micron-sized devices that manipulate the physical world. These extremely small, fast, precise and reliable devices are most commonly used in optical switching, medical and transportation devices, airbag sensors, game controllers and other industrial and consumer products. Lead-Free / Green Packages / Pb-Free / Environmentally Friendly Amkor Technology offers alternative package styles that are environmentally friendly, including lead-free and green packaging that maintain performance, reliability and high-quality standards. Amkor offers green packaging in laminate and leadframe packages. RF and Other Test Services The explosive demand for wireless and RF devices creates a need for test services . Amkor offers complete, end-to-end test solutions and is a leader in RF test . Automated Package Design Amkor uses automated package design tools that ensure your market design-to-production demands are met. 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      "pdfText": "Enabling a Microelectronic World ® Amkor Technology, Inc. Amkor Technology, Inc. Corporate Presentation May 2007 © 2007 Amkor Technology, Inc. May-07, JLUTH Safe Harbor Disclaimer This presentation may contain forward-looking statements that involve risks and uncertainties that could cause actual results to differ from anticipated results. Further information on risk factors that could affect the company’s results is detailed in Amkor’s filings with the Securities and Exchange Commission. Financial Information / Guidance Policy Amkor’s historical financial information is contained in our SEC filings. Our financial guidance for the quarter is contained in our earnings release and is effective on the date given. Our policy is to neither update nor reaffirm financial guidance during the quarter other than through broad public disclosure. © 2007 Amkor Technology, Inc. May-07, JLUTH Four decades of assembly and test operations World-class scale and scope • Global manufacturing footprint • 22,000 employees Diversified customer base; broad end-market exposure • Over 175 customers • No single customer greater than 9% of sales Strategic, long-term partnership with IBM Advanced technology focus • Leading technologies & capabilities for advanced silicon Corporate Profile © 2007 Amkor Technology, Inc. May-07, JLUTH © 2007 Amkor Technology, Inc. May-07, JLUTH Consumers Now Represent the Largest Segment of the Semiconductor Industry Source: SIA and Morgan Stanley Research Semiconductor Consumption 0% 10% 20% 30% 40% 50% 60% 70% 80% 1965 1967 1969 1971 1973 1975 1977 1979 1981 1983 1985 1987 1989 1991 1993 1995 1997 1999 2001 2003 2005E Consumer IT Government © 2007 Amkor Technology, Inc. May-07, JLUTH Technology Driving Advanced Packaging 0% 20% 40% 60% 80% 100% 2004 2005 2006 IC Wafer Capacity (in microns) > 0.7 < 0.11 Driven by the need for more I/Os and high performance Driven by the need for small size and low cost 1970s 1980s 1990s 2000s Source: IC Insights 2006. © 2007 Amkor Technology, Inc. May-07, JLUTH Amkor: Evolving Up the Value Chain Overflow Capacity Overflow Capacity Advanced Packaging Advanced Packaging Design Capabilities Design Capabilities Turnkey Services Turnkey Services Strategic Partnership Strategic Partnership Time Value Advanced Technology Design Characterization Wafer Bump Wafer Probe Assembly Final Test Supply Chain Mgt © 2007 Amkor Technology, Inc. May-07, JLUTH Semiconductor Value Chain Bump Probe Assembly Final Test VMI EMS House Wafer fab. © 2007 Amkor Technology, Inc. May-07, JLUTH OSAT market (12% CAGR) $15.8Bn By 2010, the OSAT market is projected to represent 50% of the total Assembly & Test market 2005 2010 Source: Gartner, January 2006 $27.8Bn Total assembly & test market (8% CAGR) $38.4Bn $55.7Bn IDM 50% OSAT 50% IDM 59% OSAT 41% OSAT: A Growing Piece of a Growing Pie © 2007 Amkor Technology, Inc. May-07, JLUTH Consumer demand for “high tech” • Digital TV with High Def • Gaming console replacement cycle • Wireless-enabled convergence • Flash memory consumption across portable devices Mobile phone demand is surging • 3G requires more IC content • Multimedia and other functionalities Automotive semiconductor content increasing • Sensors; Infotainment OSAT Growth Driven By Strong End Markets © 2007 Amkor Technology, Inc. May-07, JLUTH Amkor’s Broad End Market Exposure Auto / Other Computing Communications Consumer Cell phones Infrastructure Networking Broadband PCs; laptops Servers Printers Peripherals Audio / video Game consoles Consumer electronics Appliances Toys Dashboards Sensors, Air bags Medical equipment Avionics No customer over 9% of sales © 2007 Amkor Technology, Inc. May-07, JLUTH Advanced Package & Test Technology Package / Process Device System Application End Market Chip scale Memory; ASICs; Storage; Controllers; Cellular; Servers; packages FPGAs; Logic Baseband; Power mgt. Consumer electronics Micro LeadFrame ® RF; Analog; RFPAs; 802.11; Cellular; Digital cameras; Logic; Power Bluetooth; Standard logic WLAN; Consumer electronics System-in-Package RF; Memory; RFPAs; Baseband; WLAN; Cellular; Games; WLAN; Logic; Power Biometric sensors; Storage Digital cameras; PDAs Flip Chip High end logic; Chipsets; Graphics; PCs; Servers; Gaming; Mixed signal ASICs; Processors Peripherals Wafer Level Analog; Power; Power Management; Handsets; Packaging Memory; Passives Memory Modules Portable electronics Passive Networks 3-D Packaging Memory; Logic Media processors; Cellular; PDAs; Digital Baseband; Memory cameras; Disk drives MEMS Sensors; Motion & pressure sensors; Automotive; Entertainment; Micro-display Display; authentication Gaming; Handhelds Package / Process Device System Application End Market Chip scale Memory; ASICs; Storage; Controllers; Cellular; Servers; packages FPGAs; Logic Baseband; Power mgt. Consumer electronics Micro LeadFrame ® RF; Analog; RFPAs; 802.11; Cellular; Digital cameras; Logic; Power Bluetooth; Standard logic WLAN; Consumer electronics System-in-Package RF; Memory; RFPAs; Baseband; WLAN; Cellular; Games; WLAN; Logic; Power Biometric sensors; Storage Digital cameras; PDAs Flip Chip High end logic; Chipsets; Graphics; PCs; Servers; Gaming; Mixed signal ASICs; Processors Peripherals Wafer Level Analog; Power; Power Management; Handsets; Packaging Memory; Passives Memory Modules Portable electronics Passive Networks 3-D Packaging Memory; Logic Media processors; Cellular; PDAs; Digital Baseband; Memory cameras; Disk drives MEMS Sensors; Motion & pressure sensors; Automotive; Entertainment; Micro-display Display; authentication Gaming; Handhelds © 2007 Amkor Technology, Inc. May-07, JLUTH IC Package Design Wafer Bump Wafer Probe Assembly Final Test Tape & Reel Finished Goods Inventory Management Turnkey Service Offering © 2007 Amkor Technology, Inc. May-07, JLUTH Flip Chip: Turnkey Solutions 2. Probe 1. Bump 3. Assembly 4. Final Test Memory MPU ASIC DSP Chipsets Graphics 1.6 B 600 M Source: Prismark Partners 2006 2005 2010 Industry FC Unit growth • Advanced silicon = Increased electrical density • Flip chip improves speed and electrical performance • Graphics processors; networking & mobile applications driving flip chip adoption © 2007 Amkor Technology, Inc. May-07, JLUTH Wafer Level Packaging Functionality Enhancement Increases silicon performance in wireless applications Miniaturization Driving adoption of bump and WLP technologies Flip Chip Devices that are swallowed or placed in ear External Implanted High Performance Improves heat dissipation for wireless applications © 2007 Amkor Technology, Inc. May-07, JLUTH 3D Package Solutions • Vertically stacking 2 or more die to increase functionality & reduce package footprint • PoP package provides OEMs with a platform to cost effectively integrate logic + memory devices • Turnkey capability for bottom and top package applications • Broad portfolio of 3D package solutions Package-on-Package (PoP) 4SS-SCSP Stacked-SiP Amkor: #1 in PoP (by a wide margin) among OSAT Companies © 2007 Amkor Technology, Inc. May-07, JLUTH • Industry-leading “QFN” package • Outstanding thermal and electrical properties • Ideally suited for wireless and mobile applications • Highly customizable, chip-scale sized • Broad market adoption • Amkor has strong IP position Micro LeadFrame ® / MLF ® © 2007 Amkor Technology, Inc. May-07, JLUTH System-in-Package / Modules • Increased functionality + smaller size = Increased silicon integration • SiP / Modules provide Key Benefits: 9 Reduced footprint 9 Higher performance 9 Lower system cost 9 More efficient assembly Leveraging Amkor’s Core Competencies in Process Technology and Packaging © 2007 Amkor Technology, Inc. May-07, JLUTH Flip Chip Wafer Probe RF Wafer Probe Advanced Test Advanced Probe & Test Services Development for integrated software and hardware solutions • RF; mixed signal; digital; memory; strip test; advanced wafer probe Production test • Final test; wafer probe; back-end services; drop ship Custom test processing • Multiple binning / marking post test Failure Analysis • X-ray; sem; liquid crystal; electron emission scope © 2007 Amkor Technology, Inc. May-07, JLUTH Taiwan 720,000 sq. ft Taiwan 720,000 sq. ft Japan 120,000 sq. ft. Japan 120,000 sq. ft. Philippines 1.4 million sq. ft Philippines 1.4 million sq. ft Korea 2 million sq. ft. Korea 2 million sq. ft. Singapore 300,000 sq. ft Singapore 300,000 sq. ft China 1.1 million sq. ft. China 1.1 million sq. ft. U.S. 37,000 sq. ft U.S. 37,000 sq. ft Wafer Bump Probe and Test Wafer Bump Assembly & Test Assembly & Test Assembly & Test Corporate HQ R&D Test Development R&D Assembly & Test Assembly & Test Wafer Bump Wafer Level Packaging More than 5.6 million square feet of manufacturing facilities worldwide Global Strategic Manufacturing © 2007 Amkor Technology, Inc. May-07, JLUTH Amkor Business Drivers • Strategic alliance with IBM & Common Platform™ ecosystem • Leading capabilities in flip-chip and wafer level packaging • Expanding direct collaboration with OEMs • Key design wins for gaming and wireless applications • Focus areas ¾ Turnkey Flip Chip @ Wafer bump / Wafer probe / FC assembly / Final test ¾ Wafer Level Packaging ¾ 3D packaging and System-in-Package ¾ Micro LeadFrame ® and Chip Scale Packaging ¾ Advanced Test and Wafer Sort",
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      "pdfText": "Enabling a Microelectronic World ® Enabling a Microelectronic World ® Amkor provides advanced solutions for the latest generation We Enable Semiconductor Technology... ...To Reach The System ™ assembly and test microelectronics Amkor is one of the world’s largest providers of contract semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is now a strategic manufacturing partner for more than 200 of the world’s leading semiconductor companies and electronics OEMs. Amkor’s operational base encompasses more than 5 million square feet of fl oor space with production facilities, product development centers and sales & support offi ces located in key electronics manufacturing regions in Asia, Europe and the United States. CORPORATE PROFILE Amkor Design Institute ™ : • Design chain management • SiP, RF and substrate design • Web-based access & EDA support • Electrical, thermal and mechanical characterization Speeding Time to Market: Turnkey IC Design, Assembly, Test and Logistics Solutions Wafer Bump and Probe: • Electro-plated wafer bumping • Redistribution layer (RDL) metallization & technology • High volume, turnkey wafer level packaging • Integrated passive construction • Solutions for 200mm and 300mm Assembly: • Turnkey solutions for wirebond and flip chip • High-volume manufacturing in 5 Asian countries • Broad portfolio of Pb-free and Green packages • Amkor assembles around 7% of the world’s ICs Amkor creates cost effective assembly and test solutions that enable our customers to shorten their time to revenue. We offer a broad portfolio of advanced packaging and test technology and state-of-the-art design resources, together with the industry’s most extensive operational scale. VALUE PROPOSITION Final Test: • Test software development • Wafer probe • Digital, analog, mixed-signal, RF, logic & memory test • EOL Services • Strip test • Burn-in and failure analysis Logistics and Inventory Management: • Tape & reel • Dry pack • Warehousing • Drop ship to distribution centers in key electronics markets TECHNOLOGY LEADERSHIP Since pioneering the outsourcing of IC assembly and test more than 35 years ago, Amkor has developed or commercialized virtually every major advance in semiconductor packaging. With more than 300 technologists committed to research and development, we have a strong focus on developing advanced packaging and test solutions: U.S. Strategically located worldwide customer Europe Amkor Design Institute ™ Micro LeadFrame ® System-in-Package Package-on-Package Stacked Die Packaging Strip Test Test Development Wafer Bumping Wafer Level Packaging Chip Scale Packaging Green and Pb-free Packaging Game, Memory & I/O Cards Amkor employs the industry’s broadest operational footprint, with factories located in the heart of the Asian-based electronics manufacturing supply chain. Singapore Philippines Taiwan China Enabling a Microelectronic World ® As integrated circuits become faster and more complex, the “interconnect” between semiconductor and system board is the battlefield where cost and performance become critical. Over the past 36 years, Amkor’s industry-leading package design, assembly and test capabilities have enabled the application of Moore’s law to progress from semiconductor design to end product reality. Preparing for the Future Smaller . . . lighter . . . faster. . . cheaper. Consumers are demanding greater functionality and performance in a smaller space at a lower cost. The future is about increasing the penetration of semiconductors through greater integration. Whether through evolution or revolution, Amkor is at the forefront of this process by taking a leading role investing in technologies and processes that enable higher levels of silicon integration. factories and support centers... Korea Japan w w w . a m k o r . c o m",
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      "pdfText": "© Amkor Technology, Inc. Directory Updated 27 AUG 2007 CORPORATE HEADQUARTERS 1900 South Price Road Chandler, AZ 85286-6604 USA Phone: 480-821-5000 Fax: 480-821-8276 E-Mail marketing@amkor.com WORLDWIDE SALES & CUSTOMER SERVICE 3945 Freedom Circle, Suite 830 Santa Clara, CA 95054 USA Phone: 408-496-0303 Fax: 408-496-0392 3 Corporate Park, Suite 230 Irvine, CA 92612 USA Phone: 949-724-1881 Fax: 949-724-1883 1900 South Price Road Chandler, AZ 85286-6604 USA Phone: 480-821-5000 Sales Fax: 480-821-2044 Las Colinas Corporate Center 6363 North Highway 161, Suite 300 Irving, TX 75038 USA Phone: 972-580-1879 Fax: 972-518-0293 Sales Fax: 972-753-1323 Congress Square II 611 South Congress Avenue, Suite 450 Austin, TX 78704 USA Phone: 512-236-8150 Fax: 512-236-8155 7802 Thorndike Road Greensboro, NC 27409 USA Sales Phone: 336-931-1349 Fax: 336-931-1344 140 Southcenter Court, Suite 600 Morrisville, NC 27560 USA Phone: 919-459-0606 Fax: 919-941-5097 WORLDWIDE SALES & CUSTOMER SERVICE 105 Central Street, Suite 4300 Stoneham, MA 02180 USA Phone: 781-438-7800 Fax: 781-438-8414 Goshen Corporate Park 1345 Enterprise Drive West Chester, PA 19380 USA Phone: 610-431-9600 Fax: 610-431-9967 Shinjuku Daiichi Seimei Building 12F 2-7-1, Nishi-Shinjuku, Shinjuku-Ku, Tokyo 163-0712 JAPAN Phone: 81-3-5321-6470 Fax: 81-3-5321-6471 280-8, 2-ga, Seongsu-dong Seongdong-gu, Seoul 133-706 KOREA Phone: 82-2-460-5820/5808 Fax: 82-2-460-5289 Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 ATTENTION: Site P1 Phone: 63-2-850-1544 Fax: 63-2-850-7287 1F, No. 1, Kao-Ping Sec., Chung-Feng Rd. Lung Tan County, 325, Tao Yuan Hsein TAIWAN R.O.C Phone: 886-3-4719597 Fax: 886-3-4716418 2 Science Park Drive SINGAPORE 118222 Phone 65-6211-3333 Fax: 65-6324-1183 Immeuble Alliance Batiment C 74160 Archamps FRANCE Phone: 33-4-50-31-88-00 Fax: 33-4-50-31-88-01 Xin 2 Building 52, Fasai Road Waigaoqiao Free Trade Zone Shanghai 200131 CHINA Phone: 86-21-5064-4590 Fax: 86-21-5064-4598 © Amkor Technology, Inc. Directory Updated 27 AUG 2007 KOREA Amkor Technology Korea, Inc. Site K1 - Main Plant 280-8, 2-ga, Seongsu-dong Seongdong-gu, Seoul 133-706 KOREA Phone: 822-460-5114 Fax: 822-465-2607 Amkor Technology Korea, Inc. Site K3 - Bupyeong 516-1, Hyoseong-dong, Gyeyang-gu, Incheon 407-040 KOREA Phone: 8232-540-3114 Fax: 8232-540-3070 / 3071 Amkor Technology Korea, Inc. Site K4 - Gwangju 957, Daechon-dong, Buk-gu, Gwangju 500-733 KOREA Phone: 8262-970-7114 Fax: 8262-970-7241 CHINA Amkor Assembly and Test (Shanghai) Co, Ltd. Site C1 Xin 2 Building 52, Fasai Road Waigaoqiao Free Trade Zone Shanghai 200131 PRC CHINA Phone: 86-21-5064-4590 Fax: 86-21-5064-4598 Amkor Assembly and Test (Shanghai) Co, Ltd. Site C3 No. 111 Yinglun Road Waigaoqiao Free Trade Zone Pudong, Shanghai, 200131 PRC CHINA Phone: 86-21-5064-4590 Fax: 86-21-5064-4598 JAPAN Amkor Iwate Company, Ltd. Site J1 6-6 Kita-Kogyo-Danchi Kitakami, Iwate 024-8510 JAPAN Phone: 81-197-71-3241 Fax: 81-197-66-5294 WORLDWIDE MANUFACTURING SERVICES PHILIPPINES Amkor Technology Philippines (P1 / P2), Inc. Site P1 Amkor Technology - Special Economic Zone Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 Phone: 632-850-7000 Fax : 632-844-0716 Amkor Technology Philippines (P1 / P2), Inc. Site P2 Amkor Technology - Special Economic Zone Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 Phone: 632-850-7000 Fax : 632-844-0708 Amkor Technology Philippines (P3 / P4), Inc. Site P3 119 North Science Avenue Special Economic Processing Zone Laguna Technopark, Binan Laguna PHILIPPINES 4024 Phone: 632-884-3000 Fax: 632-884-3160 Amkor Technology Philippines (P3 / P4), Inc. Site P4 119 North Science Avenue Special Economic Processing Zone Laguna Technopark, Binan Laguna PHILIPPINES 4024 Phone: 632-884-3000 Fax: 632-884-3160 © Amkor Technology, Inc. Directory Updated 27 AUG 2007 TAIWAN Amkor Technology Taiwan, Inc. Site T1 1F, No. 1, Kao-Ping Sec., Chung-Feng Rd. Lung Tan County, 325, Tao Yuan Hsein TAIWAN R.O.C Phone: 886-3-4719597 Fax: 886-3-4716418 Amkor Technology Taiwan, Inc. Site T3 11 Guangfu Road, Hsinchu Industrial Park Hukou County, Hsinchu 303 Taiwan, R.O.C. Phone: 886-3-5982000 Fax: 886-3-5983985 Amkor Technology Taiwan, Inc. Site T5 Hsin-Chu Industrial Park No. 39 Kwang-Fu North Road Hsin-Chu Hsein TAIWAN R.O.C. Phone: 886-3-5972777 Fax: 886-3-5972891 SINGAPORE Amkor Technology Singapore, Pte. Ltd. Site S1 1 Kaki Bukit View #03-28 TechView Building Singapore 415941 Phone: 65-63471000 Fax: 65-67464815 Amkor Technology Singapore, Pte. Ltd. Site S3 2 Science Park Drive SINGAPORE 118222 Phone 65-6211-3333 Fax: 65-6324-1183 WORLDWIDE MANUFACTURING SERVICES NORTH AMERICA Site A5 3021 Cornwallis Road Research Triangle Park, NC 27709-4584 USA Phone: 919-248-1800 Fax: 919-941-5097",
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      "pdfText": "Enabling a Microelectronic World ® Amkor Technology, Inc. Amkor Technology, Inc. Corporate Presentation Q3 2006 © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Safe Harbor Disclaimer This presentation may contain forward-looking statements that involve risks and uncertainties that could cause actual results to differ from anticipated results. Further information on risk factors that could affect the company’s results is detailed in Amkor’s filings with the Securities and Exchange Commission. Guidance Policy Amkor’s financial guidance for the quarter is effective on the date given. Our policy is, in the normal course, to neither update nor reaffirm financial guidance during the quarter. © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH • Three decades of assembly and test operations • World-class scale and scope – Global manufacturing footprint – Over $2 Billion in revenue – 24,000 employees • Diversified customer base; broad end-market exposure – Over 175 customers – No single customer greater than 9% of sales • Strategic, long-term partnership with IBM • Advanced technology focus – Leading technologies & capabilities for advanced silicon Corporate Profile © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Consumers Now Represent the Largest Segment of the Semiconductor Industry Source: SIA and Morgan Stanley Research Semiconductor Consumption 0% 10% 20% 30% 40% 50% 60% 70% 80% 1965 1967 1969 1971 1973 1975 1977 1979 1981 1983 1985 1987 1989 1991 1993 1995 1997 1999 2001 2003 2005E Consumer IT Government © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Technology Driving Advanced Packaging 0% 20% 40% 60% 80% 100% 2004 2005 2006 IC Wafer Capacity (in microns) > 0.7 < 0.11 Driven by the need for more I/Os and high performance D riven by the need for small size and low cost 1970s 1980s 1990s 2000s Source: IC Insights 2006. © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Amkor: Evolving Up the Value Chain Overflow Capacity Overflow Capacity Advanced Packaging Advanced Packaging Design Capabilities Design Capabilities Turnkey Services Turnkey Services Strategic Partnership Strategic Partnership Time Value Advanced Technology Design Characterization Wafer Bump Wafer Probe Assembly Final Test Supply Chain Mgt © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Bump Probe Assembly Final Test VMI EMS House Wafer fab. Semiconductor Value Chain b © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH OSAT market (12% CAGR) $15.8Bn By 2010, the OSAT market is projected to represent 50% of the total Assembly & Test market 2005 2010 Source: Gartner, January 2006 $27.8Bn Total assembly & test market (8% CAGR) $38.4Bn $55.7Bn IDM 50% OSAT 50% IDM 59% OSAT 41% OSAT: A Growing Piece of a Growing Pie © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Consumer demand for “high tech” • Digital TV with High Def • Gaming console replacement cycle • Wireless-enabled convergence • Flash memory consumption across portable devices Mobile phone demand is surging • 3G requires more IC content • Multimedia and other functionalities Automotive semiconductor content increasing • Sensors; Infotainment OSAT Growth Driven By Strong End Markets © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Amkor’s Broad End Market Exposure Auto / Other Computing Communications Consumer Cell phones Infrastructure Networking Broadband PCs; laptops Servers Printers Peripherals Audio / video Game consoles Consumer electronics Appliances Toys Dashboards Sensors, Air bags Medical equipment Avionics No customer over 9% of sales © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Advanced Package & Test Technology Package / Process Device System Application End Market Chip scale Memory; ASICs; Storage; Controllers; Cellular; Servers; packages FPGAs; Logic Baseband; Power mgt. Consumer electronics Micro LeadFrame ® RF; Analog; RFPAs; 802.11; Cellular; Digital cameras; Logic; Power Bluetooth; Standard logic WLAN; Consumer electronics System-in-Package RF; Memory; RFPAs; Baseband; WLAN; Cellular; Games; WLAN; Logic; Power Biometric sensors; Storage Digital cameras; PDAs Flip Chip High end logic; Chipsets; Graphics; PCs; Servers; Gaming; Mixed signal ASICs; Processors Peripherals Wafer Level Analog; Power; Power Management; Handsets; Packaging Memory; Passives Memory Modules Portable electronics Passive Networks 3-D Packaging Memory; Logic Media processors; Cellular; PDAs; Digital Baseband; Memory cameras; Disk drives MEMS Sensors; Motion & pressure sensors; Automotive; Entertainment; Micro-display Display; authentication Gaming; Handhelds Package / Process Device System Application End Market Chip scale Memory; ASICs; Storage; Controllers; Cellular; Servers; packages FPGAs; Logic Baseband; Power mgt. Consumer electronics Micro LeadFrame ® RF; Analog; RFPAs; 802.11; Cellular; Digital cameras; Logic; Power Bluetooth; Standard logic WLAN; Consumer electronics System-in-Package RF; Memory; RFPAs; Baseband; WLAN; Cellular; Games; WLAN; Logic; Power Biometric sensors; Storage Digital cameras; PDAs Flip Chip High end logic; Chipsets; Graphics; PCs; Servers; Gaming; Mixed signal ASICs; Processors Peripherals Wafer Level Analog; Power; Power Management; Handsets; Packaging Memory; Passives Memory Modules Portable electronics Passive Networks 3-D Packaging Memory; Logic Media processors; Cellular; PDAs; Digital Baseband; Memory cameras; Disk drives MEMS Sensors; Motion & pressure sensors; Automotive; Entertainment; Micro-display Display; authentication Gaming; Handhelds © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH IC Package Design Wafer Bump Wafer Probe Assembly Final Test Tape & Reel Finished Goods Inventory Management Turnkey Service Offering © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Flip Chip: Turnkey Solutions 2. Probe 1. Bump 3. Assembly 4. Final Test Memory MPU ASIC DSP Chipsets Graphics 1.6 B 600 M Source: Prismark Partners 2006 2005 2010 Industry FC Unit growth • Advanced silicon = Increased electrical density • Flip chip improves speed and electrical performance • Graphics processors; networking & mobile applications driving flip chip adoption © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Wafer Level Packaging Functionality Enhancement Increases silicon performance in wireless applications Miniaturization Driving adoption of bump and WLP technologies Flip Chip Devices that are swallowed or placed in ear External Implanted High Performance Improves heat dissipation for wireless applications © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH 3D Package Solutions • Vertically stacking 2 or more die to increase functionality & reduce package footprint • PoP package provides OEMs with a platform to cost effectively integrate logic + memory devices • Turnkey capability for bottom and top package applications • Broad portfolio of 3D package solutions Package-on-Package (PoP) 4SS-SCSP Stacked-SiP © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH • Leads on perimeter and bottom of package • “Hybrid” package combines characteristics of QFN and QFP formats • Accommodates higher I/O devices in reduced footprint • Enhanced electrical and thermal performance • Ideal for high frequency applications • Industry-leading “QFN” package • Outstanding thermal and electrical properties • Ideally suited for wireless and mobile applications • Highly customizable, chip-scale sized • Broad market adoption • Amkor has strong IP position Micro LeadFrame ® / MLF® FusionQuadTM © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH System-in-Package / Modules • Increased functionality + smaller size = increased silicon integration • SiP / Modules provide Key Benefits : 9 Reduced footprint 9 Higher performance 9 Lower system cost 9 More efficient assembly Leveraging Amkor’s Core Competencies in Process Technology and Packaging © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Flip Chip Wafer Probe RF Wafer Probe Advanced Test Advanced Probe & Test Services Development services for integrated software and hardware solutions • RF; mixed signal; digital; memory; strip test; advanced wafer probe Production test • Final test; wafer probe; back-end services; drop ship Custom test processing • Multiple binning / marking post test Failure Analysis • X-ray; sem; liquid crystal; electron emission scope © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Taiwan 720,000 sq. ft Taiwan 720,000 sq. ft Japan 120,000 sq. ft. Japan 120,000 sq. ft. Philippines 1.4 million sq. ft Philippines 1.4 million sq. ft Korea 2 million sq. ft. Korea 2 million sq. ft. Singapore 300,000 sq. ft Singapore 300,000 sq. ft China 1.1 million sq. ft. China 1.1 million sq. ft. U.S. 37,000 sq. ft U.S. 37,000 sq. ft Wafer Bump Probe and Test Wafer Bump Assembly & Test Assembly & Test Assembly & Test Corporate HQ R&D Test Development R&D Assembly & Test Assembly & Test Wafer Bump Wafer Level Packaging More than 5.6 million square feet of manufacturing facilities worldwide Global Strategic Manufacturing © 2006 Amkor Technology, Inc. Amkor Proprietary Business Information Nov-06, JLUTH Amkor Business Drivers • Strategic alliance with IBM & Common Platform ecosystem • Leading capabilities in flip-chip and wafer level packaging • Expanding direct collaboration with key OEMs • Key design wins for gaming and wireless applications • Focus areas ¾ Turnkey Flip Chip @ Wafer bump / Wafer probe / FC assembly / Final test ¾ Wafer Level Packaging ¾ 3D packaging and System-in-Package ¾ Micro LeadFrame ® and Chip Scale Packaging ¾ Advanced Test and Wafer Sort",
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Directory Updated 07/25/06 EXECUTIVE OFFICES Goshen Corporate Park 1345 Enterprise Drive West Chester, PA 19380 USA Phone: 610- 431-9600 Fax: 610- 431-5881 CORPORATE HEADQUARTERS 1900 South Price Road Chandler, AZ 85248 USA Phone: 480-821-5000 Fax: 480-821-8276 WORLDWIDE SALES & CUSTOMER SERVICE 3945 Freedom Circle, Suite 830 Santa Clara, CA 95054 USA Phone: 408-496-0303 Fax: 408-496-0392 3 Corporate Park, Suite 230 Irvine, CA 92612 USA Phone: 949-724-1881 Fax: 949-724-1883 1900 South Price Road Chandler, AZ 85248 USA Phone: 480-821-5000 Sales Fax: 480-821-2044 Las Colinas Corporate Center 6363 North Highway 161, Suite 300 Irving, TX 75038 USA Phone: 972-580-1879 Fax: 972-518-0293 Sales Fax: 972-753-1323 Bank of America Tower 515 Congress Avenue, Suite 1200 Austin, TX 78701 USA Phone: 512-236-8150 Fax: 512-236-8155 7802 Thorndike Road Greensboro, NC 27409 USA Sales Phone: 336-931-1349 Fax: 336-931-1344 140 Southcenter Court, Suite 600 Morrisville, NC 27560 USA Phone: 919-459-1239 Fax: 919-941-5097 WORLDWIDE SALES & CUSTOMER SERVICE (Cont.) 105 Central Street, Suite 4300 Stoneham, MA 02180 USA Phone: 781-438-7800 Fax: 781-438-8414 Goshen Corporate Park 1345 Enterprise Drive West Chester, PA 19380 USA Phone: 610-431-9600 Fax: 610-431-9967 Shinjuku Daiichi Seimei Building 12F 2-7-1, Nishi-Shinjuku, Shinjuku-Ku, Tokyo 163-0712 JAPAN Phone: 81-3-5321-6470 Fax: 81-3-5321-6471 280-8, 2-ga, Seongsu-dong Seongdong-gu, Seoul 133-706 KOREA Phone: 82-2-460-5820/5808 Fax: 82-2-460-5289 Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 ATTENTION: Site P1 Phone: 63-2-850-1544 Fax: 63-2-850-7287 1F, No. 1, Kao-Ping Sec., Chung-Feng Rd. Lung Tan County, 325, Tao Yuan Hsein TAIWAN R.O.C Phone: 886-3-4719597 Fax: 886-3-4716418 2 Science Park Drive SINGAPORE 118222 Phone 65-6211-3333 Fax: 65-6324-1183 Immeuble Alliance Batiment C 74160 Archamps FRANCE Phone: 33-4-50-31-88-00 Fax: 33-4-50-31-88-01 Regus (UK) Ltd. Windmill Hill Business Park Whitehill Way Swindon, Wiltshire SN5 6QR ENGLAND Phone: 44-870-351-6974 Fax: 44-870-351-6975 Xin 2 Building 52, Fasai Road Waigaoqiao Free Trade Zone Shanghai 200131 CHINA Phone: 86-21-5064-4590 Fax: 86-21-5064-4598 © Amkor Technology, Inc. Directory Updated 07/25/06 KOREA Amkor Technology Korea, Inc. Site K1 - Main Plant 280-8, 2-ga, Seongsu-dong Seongdong-gu, Seoul 133-706 KOREA Phone: 822-460-5114 Fax: 822-465-2607 Amkor Technology Korea, Inc. Site K3 - Bupyeong 516-1, Hyoseong-dong, Gyeyang-gu, Incheon 407-040 KOREA Phone: 8232-540-3114 Fax: 8232-540-3070 / 3071 Amkor Technology Korea, Inc. Site K4 - Gwangju 957, Daechon-dong, Buk-gu, Gwangju 500-733 KOREA Phone: 8262-970-7114 Fax: 8262-970-7241 CHINA Amkor Assembly and Test (Shanghai) Co, Ltd. Site C1 Xin 2 Building 52, Fasai Road Waigaoqiao Free Trade Zone Shanghai 200131 PRC CHINA Phone: 86-21-5064-4590 Fax: 86-21-5064-4598 Amkor Assembly and Test (Shanghai) Co, Ltd. Site C3 No. 111 Yinglun Road Waigaoqiao Free Trade Zone Pudong, Shanghai, 200131 PRC CHINA Phone: 86-21-5064-4590 Fax: 86-21-5064-4598 JAPAN Amkor Iwate Company, Ltd. Site J1 6-6 Kita-Kogyo-Danchi Kitakami, Iwate 024-8510 JAPAN Phone: 81-197-71-3241 Fax: 81-197-66-5294 WORLDWIDE MANUFACTURING SERVICES PHILIPPINES Amkor Technology Philippines (P1/P2), Inc. Site P1 Amkor Technology - Special Economic Zone Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 Phone: 632-850-7000 Fax : 632-844-0716 Amkor Technology Philippines (P1/P2), Inc. Site P2 Amkor Technology - Special Economic Zone Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 Phone: 632-850-7000 Fax : 632-844-0708 Amkor Technology Philippines (P3/P4), Inc. Site P3 119 North Science Avenue Special Economic Processing Zone Laguna Technopark, Binan Laguna PHILIPPINES 4024 Phone: 632-884-3000 Fax: 632-884-3160 Amkor Technology Philippines (P3/P4), Inc. Site P4 119 North Science Avenue Special Economic Processing Zone Laguna Technopark, Binan Laguna PHILIPPINES 4024 Phone: 632-884-3000 Fax: 632-884-3160 © Amkor Technology, Inc. Directory Updated 07/25/06 TAIWAN Amkor Technology Taiwan, Inc. Site T1 1F, No. 1, Kao-Ping Sec., Chung-Feng Rd. Lung Tan County, 325, Tao Yuan Hsein TAIWAN R.O.C Phone: 886-3-4719597 Fax: 886-3-4716418 Amkor Technology Taiwan, Inc. Site T3 11 Guangfu Road, Hsinchu Industrial Park Hukou County, Hsinchu 303 Taiwan, R.O.C. Phone: 886-3-5982000 Fax: 886-3-5983985 SINGAPORE Amkor Technology Singapore, Pte. Ltd. Site S1 1 Kaki Bukit View #03-28 TechView Building Singapore 415941 Phone: 65-63471000 Fax: 65-67464815 Amkor Technology Singapore, Pte. Ltd. Site S3 2 Science Park Drive SINGAPORE 118222 Phone 65-6211-3333 Fax: 65-6324-1183 WORLDWIDE MANUFACTURING SERVICES (Cont.) Unitive, An Amkor Technology Company Unitive Inc. 3021 Cornwallis Road Research Triangle Park, NC 27709-4584 USA Phone: 919-941-0606 Fax: 919-941-5097 Unitive Semiconductor Taiwan Site T5 Hsin-Chu Industrial Park No. 39 Kwang-Fu North Road Hsin-Chu Hsein TAIWAN R.O.C. Phone: 886-3-5972777 Fax: 886-3-5972891",
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      "pdfText": "© Amkor Technology, Inc. Directory Updated 09/27/05 EXECUTIVE OFFICES Goshen Corporate Park 1345 Enterprise Drive West Chester, PA 19380 USA Phone: 610- 431-9600 Fax: 610- 431-5881 CORPORATE HEADQUARTERS 1900 South Price Road Chandler, AZ 85248 USA Phone: 480-821-5000 Fax: 480-821-8276 AMKOR TEST SERVICES 3450 N. Rock Road Building 100, Suite 111 Wichita, KS 67226 USA Phone: 800-622-2382 Fax: 316-630-6877 WORLDWIDE SALES & CUSTOMER SERVICE 3945 Freedom Circle, Suite 830 Santa Clara, CA 95054 USA Phone: 408-496-0303 Fax: 408-496-0392 3 Corporate Park, Suite 230 Irvine, CA 92612 USA Phone: 949-724-1881 Fax: 949-724-1883 1900 South Price Road Chandler, AZ 85248 USA Phone: 480-821-5000 Sales Fax: 480-821-2044 Las Colinas Corporate Center 6363 North Highway 161, Suite 300 Irving, TX 75038 USA Phone: 972-580-1879 Fax: 972-518-0293 Sales Fax: 972-753-1323 Bank of America Tower 515 Congress Avenue, Suite 1200 Austin, TX 78701 USA Phone: 512-236-8150 Fax: 512-236-8155 7802 Thorndike Road Greensboro, NC 27409 USA Sales Phone: 336-931-1349 Fax: 336-931-1344 3021 Corwallis Road Research Triangle Park, NC 27709 USA Phone: 919-941-0606 Fax: 919-941-5097 WORLDWIDE SALES & CUSTOMER SERVICE (Cont.) 105 Central Street, Suite 4300 Stoneham, MA 02180 USA Phone: 781-438-7800 Fax: 781-438-8414 Goshen Corporate Park 1345 Enterprise Drive West Chester, PA 19380 USA Phone: 610-431-9600 Sales Fax: 610-431-9700 Shinjuku Daiichi Seimei Building 12F 2-7-1, Nishi-Shinjuku, Shinjuku-Ku, Tokyo 163-0712 JAPAN Phone: 81-3-5321-6470 Fax: 81-3-5321-6471 280-8, 2-ga, Seongsu-dong Seongdong-gu, Seoul 133-706 KOREA Phone: 82-2-460-5820/5808 Fax: 82-2-460-5289 Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 ATTENTION: Site P1 Phone: 63-2-850-1544 Fax: 63-2-850-7287 1F, No. 1, Kao-Ping Sec., Chung-Feng Rd. Lung Tan County, 325, Tao Yuan Hsein TAIWAN R.O.C Phone: 886-3-4719597 Fax: 886-3-4716418 143 Cecil Street #22-01 GB Building SINGAPORE 069542 Phone 65-6324-0722 Fax: 65-6324-1183 Immeuble Alliance Batiment C 74160 Archamps FRANCE Phone: 33-4-50-31-88-00 Fax: 33-4-50-31-88-01 2nd floor, 19-21 Newport Street Swindon, Wiltshire SN1 3DX ENGLAND Phone: 44-1793-484-290 Fax: 44-1793-484-291 Xin 2 Building 52, Fasai Road Waigaoqiao Free Trade Zone Shanghai 200131 CHINA Phone: 86-21-5064-4590 Fax: 86-21-5064-4598 © Amkor Technology, Inc. Directory Updated 09/27/05 KOREA Amkor Technology Korea, Inc. Site K1 - Main Plant 280-8, 2-ga, Seongsu-dong Seongdong-gu, Seoul 133-706 KOREA Phone: 822-460-5114 Fax: 822-465-2607 Amkor Technology Korea, Inc. Site K3 - Bupyeong 516-1, Hyoseong-dong, Gyeyang-gu, Incheon 407-040 KOREA Phone: 8232-540-3114 Fax: 8232-540-3070 / 3071 Amkor Technology Korea, Inc. Site K4 - Gwangju 957, Daechon-dong, Buk-gu, Gwangju 500-733 KOREA Phone: 8262-970-7114 Fax: 8262-970-7241 PHILIPPINES Amkor Technology Philippines (P1/P2), Inc. Site P1 Amkor Technology - Special Economic Zone Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 Phone: 632-850-7000 Fax : 632-844-0716 Amkor Technology Philippines (P1/P2), Inc. Site P2 Amkor Technology - Special Economic Zone Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 Phone: 632-850-7000 Fax : 632-844-0708 Amkor Technology Philippines (P3/P4), Inc. Site P3 119 North Science Avenue Special Economic Processing Zone Laguna Technopark, Binan Laguna PHILIPPINES 4024 Phone: 632-884-3000 Fax: 632-884-3160 Amkor Technology Philippines (P3/P4), Inc. Site P4 119 North Science Avenue Special Economic Processing Zone Laguna Technopark, Binan Laguna PHILIPPINES 4024 Phone: 632-884-3000 Fax: 632-884-3160 CHINA Amkor Assembly and Test (Shanghai) Co, Ltd. Site C1 Xin 2 Building 52, Fasai Road Waigaoqiao Free Trade Zone Shanghai 200131 CHINA Phone: 86-21-5064-4590 Fax: 86-21-5064-4598 TAIWAN Amkor Technology Taiwan, Inc. Site T1 1F, No. 1, Kao-Ping Sec., Chung-Feng Rd. Lung Tan County, 325, Tao Yuan Hsein TAIWAN R.O.C Phone: 886-3-4719597 Fax: 886-3-4716418 Amkor Technology Taiwan, Inc. Site T3 11 Guangfu Road, Hsinchu Industrial Park Hukou County, Hsinchu 303 Taiwan, R.O.C. Phone: 886-3-5982000 Fax: 886-3-5983985 JAPAN Amkor Iwate Company, Ltd. Site J1 6-6 Kita-Kogyo-Danchi Kitakami, Iwate 024-8510 JAPAN Phone: 81-197-71-3241 Fax: 81-197-66-5294 SINGAPORE Amkor Technology Singapore, Pte. Ltd. Site S1 1 Kaki Bukit View #03-28 TechView Building Singapore 415941 Phone: 65-63471000 Fax: 65-67464815 Unitive, An Amkor Technology Company Unitive Inc. 3021 Cornwallis Road Research Triangle Park, NC 27709-4584 USA Phone: 919-941-0606 Fax: 919-941-5097 Unitive Semiconductor Taiwan Hsin-Chu Industrial Park No. 39 Kwang-Fu North Road Hsin-Chu Hsein TAIWAN R.O.C. Phone: 886-3-5972777 Fax: 886-3-5972891 WORLDWIDE MANUFACTURING SERVICES",
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      "pdfText": "Enabling a Microelectronic World ® Enabling a Microelectronic World ® igital cameras. Cell phones. Network servers. Laptops. Video games. MP3 players. When Amkor Technology was founded in 1968, many of the products that we take for granted today existed only in the mind's eye of visionaries. D Amkor helped make these visions a reality by pioneering the outsourcing of semiconductor assembly and test services. Today, Amkor is a strategic manufacturing resource for many of the world's leading semiconductor companies. We have developed unique expertise in high-volume manufacturing techniques and have diversified and expanded our operational scope by establishing production centers in strategic locations throughout Asia. With its superior electrical and thermal characteristics, Amkor’s MicroLeadframe ® family of packages has become a critical solution for a broad range of applications including RF wireless, WLAN, Bluetooth™ and analog. Leading the Industry Amkor provides leading-e edge package solutions for latest generation applications s integrated circuits increase in speed and complexity, the right semiconductor packaging becomes critical to ensure optimal system performance. Amkor is an industry leader in tailoring application-specific package design, assembly and test solutions. Amkor offers the industry’s broadest array of package formats and sizes, from traditional, “off-the-shelf” leadframe configurations to leading-edge chip scale, flip chip and System-in-Package solutions incorporating highly customized designs. This allows Amkor to be a single source for many of our customers’ total IC packaging requirements. We also provide a complete range of test engineering services for RF, mixed signal, logic and memory devices, from test program development to full product characterization. Amkor is a major provider of RF test services and is the world leader in Strip Test, an innovative, highly parallel test solution that offers customers low cost, faster index time and improved test yields. A With Amkor providing turnkey solutions that include semiconductor design, packaging, test and drop-shipment services, our customers can accelerate time-to-revenue for their new products. Photo courtesy of STMicroelectronics Delivering Solutions S Sp pe ee ed di in ng g T Ti im me e- -t to o- -R Re ev ve en nu ue e • C Co ol ll la ab bo or ra at ti in ng g with customers and leading OEMs to develop comprehensive package solutions • E En na ab bl li in ng g next-g generation performance at the system level • A Ac cc ce el le er ra at ti in ng g the development and deployment of new microelectronic applications mkor has more than five million square feet of manufacturing space in 13 factories strategically located in key microelectronic manufacturing centers throughout Asia. Our customers benefit from the industry's most extensive operational footprint , which enables us to easily handle large orders and quick turnaround times. Amkor supplements its world-class operational scope with the industry’s • largest package design staff • broadest portfolio of packaging technology • deepest sales & support organization. Focusing on our core competencies allows our customers to optimize their assets and reduce time-to-sales. A Amkor is providing assembly and test services for Texas Instrument’s Digital Micromirror Device, which is the heart of their DLP™ Technology. Photo courtesy of Texas Instruments The Industry’s Broadest Reach Amkor factories are strategically located in the heart of Asia’s microelectronic manufacturing centers J Ja ap pa an n S So ou ut th h K Ko or re ea a C Ch hiin na a T Ta aiiw wa an n P Ph hiilliip pp piin ne es s S Siin ng ga ap po or re e CB002B 0704",
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      "pdfText": "www.amkor.com Yes, we do that! VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. 10’02 Technology Leadership with Cost Effective High-Volume Manufacturing Amkor provides microelectronic assembly, packaging, and test services. Amkor manufactures billions of assembled units per year. We provide more than seven percent of the world’s semiconductor packaging requirements. In addition to producing some of the highest volume, lowest cost traditional microelectronic packages, Amkor is a leader in the latest packaging technology, enabling our customers to produce their products to meet today’s market demands. Micro LeadFrame™ (MLF) Amkor's MLF packages provide a cost-effective answer to the demand for small size and high-performance integrity in a cost-effective leadframe package, including exceptional RF and thermal management characteristics, enabling greater capability in smaller spaces for portable devices. Wafer Bumping/Flip Chip Technology Amkor is a leader in wafer-bumping technology for silicon and smaller, high-speed applications. Amkor's flip chip solutions for high bandwidth and wireless/RF applications improve signal integrity, performance and reduce costs for highest performance ASICs. Flip chip interconnection improves signal integrity by significantly decreasing inductance and improving impedance. This allows direct power routing to the center of the die, decreasing the power and ground loop inductance and utilizing the entire die. The design permits die shrinks that translate into significant silicon cost savings and smaller package footprint. Stacked and 3D Innovative end use products challenge IC package-mounted height requirements to new extremes. Amkor provides extremely thin single-chip and 3D packaging technologies that enable a range of emerging applications requiring highly-integrated solutions. Amkor's enabling technologies in thin or 3D package platforms provide ongoing advancements in package form factor, electrical, thermal and reliability, allowing 2x to 3x density in the same footprint. System in Package (SiP) Amkor's SiP module, consisting of multiple semiconductor chips and passive circuit elements in a modified conventional IC package, is perfect for the expanding integration needs of a cost-sensitive market. SiPs are an ideal solution for high-speed switches, memory modules and wireless applications. Amkor expects SiP to see extended future use in vision and optoelectronic markets. Amkor offers a full service SiP approach from design to test. Microelectronic Assembly and Test Enabling a Microelectronic World™ www.amkor.com VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. Memory Packages/Memory Cards Amkor has expanded its assembly technology and test capacity to include flash memory cards that achieve higher storage densities. These applications include the use of stacked die to meet the growing market requirements of digital photography and digital audio equipment. Microelectromechanical Systems (MEMS) Amkor Technology is the world's largest independent packaging provider of microelectromechanical systems (MEMS), micron-sized devices that manipulate the physical world. These extremely small, fast, precise and reliable devices are most commonly used in optical switching, medical and transportation devices, airbag sensors, game controllers and other industrial and consumer products. Optical Sensors/Vision Amkor is a leader in optical sensor package technology. Amkor's VisionPak ® family answers the challenge of con- verging computing and vision technologies that create portable video conferencing and biometric tools and camera module solutions for cellular phones, PDAs and notebooks. With packages manufactured in ceramic or laminate substrates, Amkor can meet the most difficult optical sensor needs. Lead-Free/Green Packages/Environmentally Friendly Amkor Technology offers alternative package styles that are environmentally friendly, including lead-free and green packaging that maintain performance, reliability and high-quality standards. Amkor offers green packaging in laminate and leadframe packages. RF and Other Test Services The explosive demand for wireless and RF devices creates a need for test services. Amkor offers complete, end-to-end test solutions and is a leader in RF test. Prototype Development Amkor's U.S.-based prototype development lab uses state-of-the-art equipment and technology to ensure customers that their products are reliable, cost-efficient and can be manufactured in high volumes in the shortest possible time-to-market. The prototype development center specializes in producing flip chip packaging and multichip modules for wireless, RF and memory applications. Automated Package Design Amkor uses automated package design tools that ensure your market design-to-production demands are met. Enabling a Microelectronic World™ Yes, we do that!",
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      "pdfText": "© Amkor Technology, Inc. Directory Updated 02/19/04 CORPORATE HEADQUARTERS Amkor Technology, Inc. Goshen Corporate Park 1345 Enterprise Drive West Chester, PA 19380 USA Phone: 610- 431-9600 Fax: 610- 431-5881 OPERATIONS HEADQUARTERS Amkor Technology, Inc. 1900 South Price Road Chandler, AZ 85248 USA Phone: 480-821-5000 Fax: 480-821-8276 AMKOR TEST SERVICES Amkor Test Services, a division of Amkor Technology, Inc. 3450 N. Rock Road Building 100, Suite 111 Wichita, KS 67226 USA Phone: 800-622-2382 Fax: 316-630-6877 WORLDWIDE SALES & CUSTOMER SERVICE Amkor Technology, Inc. 3945 Freedom Circle, Suite 830 Santa Clara, CA 95054 USA Phone: 408-496-0303 Fax: 408-496-0392 Amkor Technology, Inc. 3 Corporate Park, Suite 230 Irvine, CA 92606 USA Phone: 949-724-1183 Fax: 949-724-8925 Amkor Technology, Inc. 1900 South Price Road Chandler, AZ 85248 USA Phone: 480-821-5000 Sales Fax: 480-821-2044 Amkor Technology, Inc. Las Colinas Corporate Center 6363 North Highway 161, Suite 300 Irving, TX 75038 USA Phone: 972-580-1879 Fax: 972-518-0293 Sales Fax: 972-753-1323 Amkor Technology, Inc. Bank of America Center 515 Congress Avenue, Suite 1200 Austin, TX 78701 USA Phone: 512-236-8150 Fax: 512-236-8155 Amkor Technology, Inc. 7800 Airport Center Drive, Suite 401 Greensboro, NC 27409 USA Phone: 336-478-2314 Fax: 336-478-2399 WORLDWIDE SALES & CUSTOMER SERVICE (Continued) Amkor Technology, Inc. 105 Central Street, Suite 4300 Stoneham, MA 02180 USA Phone: 781-438-7800 Fax: 781-438-8414 Amkor Technology, Inc. Goshen Corporate Park 1345 Enterprise Drive West Chester, PA 19380 USA Phone: 610-431-9600 Sales Fax: 610-431-9700 Amkor Technology Japan, KK Shinjuku Daiichi Seimei Building 12F 2-7-1, Nishi-Shinjuku, Shinjuku-Ku, Tokyo 163-0712 JAPAN Phone: 81-3-5321-6470 Fax: 81-3-5321-6471 Amkor Technology Korea, Inc. 280-8, 2-ga, Seongsu-dong Seongdong-gu, Seoul 133-706 KOREA Phone: 82-2-460-5820/5808 Fax: 82-2-460-5289 Amkor Technology Philippines (P1/P2), Inc. Amkor Technology - Special Economic Zone Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 ATTENTION: Site P1 Phone: 63-2-850-1544 Fax: 63-2-850-7287 Amkor Technology, Inc. 1F, No. 1, Kao- Ping Sec., Chung-Feng Rd. Lung Tan County, 325, Tao Yuan Hsein TAIWAN R.O.C Phone: 886-3-471-9597 Fax: 886-3-471-6418 Amkor Technology, Inc. 143 Cecil Street #22-01 GB Building SINGAPORE 069542 Phone 65-63240722 Fax: 65-63241183 Amkor Technology Euroservices, SARL BP 99, 13 Chemin du Levant 01213 Ferney-Voltaire CEDEX FRANCE Phone: 33-4-50-40-97-97 Fax: 33-4-50-40-98-88 Amkor Technology Euroservices, SARL 2nd floor, 19-21 Newport Street Swindon, Wiltshire SN1 3DX ENGLAND Phone: 44-1793-484-290 Fax: 44-1793-484-291 Amkor Assembly & Test Co, Ltd. Xin 2 Building 52, Fasai Road Waigaoqiao Free Trade Zone Shanghai 200131 CHINA Phone: 86-21-5064-4590 Fax: 86-21-5064-4598 © Amkor Technology, Inc. Directory Updated 02/19/04 WORLDWIDE MANUFACTURING, KOREA Amkor Technology Korea, Inc. K1 - Main Plant 280-8, 2-ga, Seongsu-dong Seongdong-gu, Seoul 133-706 KOREA Phone: 822-460-5114 Fax: 822-465-2607 Amkor Technology Korea, Inc. K3 - Bupyeong 516-1, Hyoseong-dong, Gyeyang-gu, Incheon 407-040 KOREA Phone: 8232-540-3114 Fax: 8232-540-3070 / 3071 Amkor Technology Korea, Inc K4 - Gwangju 957, Daechon-dong, Buk-gu, Gwangju 500-733 KOREA Phone: 8262-970-7114 Fax: 8262-970-7241 WORLDWIDE MANUFACTURING, PHILIPPINES Amkor Technology Philippines (P1/P2), Inc. Site P1 Amkor Technology - Special Economic Zone Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 Phone: 632-850-7000 Fax : 632-844-0716 Amkor Technology Philippines (P1/P2), Inc. Site P2 Amkor Technology - Special Economic Zone Km 22, East Service Road Cupang, Muntinlupa City PHILIPPINES 1702 Phone: 632-850-7000 Fax: 632-844-0708 Amkor Technology Philippines (P3/P4), Inc. Site P3 119 North Science Avenue Special Economic Processing Zone Laguna Technopark, Binan Laguna PHILIPPINES 4024 Phone: 632-884-3000 Fax: 632-884-3160 Amkor Technology Philippines (P3/P4), Inc. Site P4 119 North Science Avenue Special Economic Processing Zone Laguna Technopark Binan, Laguna PHILIPPINES 4024 Phone: 632-884-3000 Fax: 632-884-3160 WORLDWIDE MANUFACTURING, CHINA Amkor Assembly and Test (Shanghai) Co, Ltd. Xin 2 Building 52, Fasai Road Waigaoqiao Free Trade Zone Shanghai 200131 CHINA Phone: 86-21-5064-4590 Fax: 86-21-5064-4598 WORLDWIDE MANUFACTURING, JAPAN Amkor Iwate Company, Ltd. 6-6 Kita-Kougyou-Danchi Kitakami, Iwate 024-8650 JAPAN Phone: 81-197-71-3241 Fax: 81-197-66-5294 WORLDWIDE MANUFACTURING, TAIWAN Amkor Technology Taiwan, Inc. Site T1 1F, No. 1, Kao- Ping Sec., Chung-Feng Rd. Lung Tan County, 325, Tao Yuan Hsein TAIWAN R.O.C Phone: 886-3-4719597 Fax: 886-3-4716418 Amkor Technology Taiwan, Inc. Site T3 11 Guangfu Road, Hsinchu Industrial Park Hukou County, Hsinchu 303 Taiwan, R.O.C. Phone: 886-3-5982000 Fax: 886-3-5983985",
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      "pdfText": "i Dear Amkor Employee, As representatives of Amkor Technology, we are each responsible for helping to define our company in a positive way. The purpose of this Code of Business Conduct and Ethical Guidelines is to assist us in understanding the values and beliefs that we share, and stand for as an organization. This booklet describes the responsibilities that Amkor employees share. It offers many guidelines, but it can’t make decisions for you. You should seek guidance from your management, HR or the Legal Department if you have questions. I urge you to read this booklet and discuss it with your management. Through our alignment to our values, and in demonstrating commitment to this code of conduct, we will ensure that our message to our constituencies and each other is clear. The Amkor team will operate at the highest level of integrity and strive to demonstrate exemplary behavior. Sincerely, John Boruch President and Chief Operating Officer i i Introduction Our business environment is constantly changing. We can count on changes in our products, our people, our customers, and our suppliers. What will not change is our commitment to our company values. Our values are the foundation for sustaining our business environment within Amkor. They are: u Respect and Integrity u High Energy u Teamwork and Cooperation u Caring and Well Being of our People u Open Communication These values define who we are as a company – to each other, to our customers, our suppliers and to our shareholders. They define what we stand for, and they are guiding principles for behavior. Our company values are demonstrated through the following examples: Respect & Integrity u When we need to give constructive feedback to each other, we speak about the issue, not the person. We are not condescending or rude. u Respect goes beyond how we treat each other and includes how we treat the company. • We conserve and optimize our resources – this includes time and money. • We speak highly of Amkor. u We don’t give our word unless we know we can meet our commitment. u We recognize that gossip is destructive, and we strive to eliminate it. iii High Energy u When a customer presents us with a challenge, our first response is to look for ways to meet their needs. We respond eagerly to opportunities for innovative thinking. u We know that enthusiasm is spirited by people who support each other, so we make a concentrated effort to offer support when others are down, and to back each other up when the pressure is on. u We boldly take calculated risks. Teamwork & Cooperation u Knowing we can’t get our job done without other people, we have team/departmental meetings to keep our people up to date on new information. u We use a team approach in decision making by involving key players before a commitment is made. u We recognize people who contribute to our success. Caring & Well Being of Our People u We support one another in finding the best ways to maximize their contributions to Amkor’s success – through personal growth, learning and development, or job changes. u We make a point to have fun in our work because it refuels and inspires us. u We encourage each other to think and act creatively and go beyond the fears that inhibit growth. Open Communication u We are accessible to one another. u We deal openly and honestly with conflict by taking concerns directly to the person responsible. Our focus is on the issue, not the person. i v u We recognize the importance of sharing our ideas, expressing gratitude and recognizing others. Our values provide the foundation of our business culture, and our Code of Business Conduct and Ethical Guidelines provides information about the way employees are to do business at Amkor. These guidelines provide the foundation for understanding how to handle most business situations in the honest and professional manner expected of every Amkor employee. Although the Code of Business Conduct and Ethical Guidelines applies to all Amkor Technology employees, international laws or customs may sometimes require us to modify the practices that we have outlined here. In all cases, common sense should prevail, and if you have any questions or concerns about the proper course of action, discuss the situation with your supervisor or with Human Resources. Please keep in mind that failure to conduct business in compliance with these guidelines may result in disciplinary action, up to and including termination. These guidelines should be a part of your daily working practices. If you need further guidance in applying them to your specific situation, your supervisor or manager should be able to help you. In some cases, you may need to contact a group such as the Legal Department or Human Resources for more specific guidelines or opinions. When in doubt, ask! Your understanding of these guidelines will help to ensure that the company and our employees conduct their business with uncompromising integrity and professionalism. 1 Contents Definition and Applicability .................................................................................................... 2 Employees and the Workplace Environment .................................................................. 3 Compensation and Benefits ................................................................................................... 6 Work Hours .................................................................................................................................... 7 Environmental, Safety and Health ....................................................................................... 8 Physical Security .......................................................................................................................... 9 Internal Information Posting ................................................................................................. 10 Quality ............................................................................................................................................ 11 Assets .............................................................................................................................................. 13 Employee Reimbursements/Advances ............................................................................ 16 Ethics and Compliance ............................................................................................................. 17 Conflict of Interest and Disclosure ................................................................................... 20 Antitrust Compliance .............................................................................................................. 22 Using Insider Information ...................................................................................................... 23 External Communications ..................................................................................................... 25 Phone Numbers ........................................................................................................................ 26 2 Definition and Applicability To run its business effectively, Amkor Technology has developed management tools that include a mission statement, corporate values and strategic objectives. In addition, we have created a Code of Business Conduct and Ethical Guidelines upon which the operation of the business is based. This Code of Business Conduct and Ethical Guidelines is a standing guide for handling business situations in an honest and professional manner, and should be used in determining key business decisions and actions. All guidelines: u Reflect a corporate decision on how we perform global activities u Are relevant to all Amkor employees worldwide u Are approved and managed by Amkor Executive Staff These principles are not intended to be all-inclusive, but they do provide important information about the company’s preferred ways of doing business. Local or department guidelines may be issued in various offices to supplement or implement the principles. 3 Employees and the Workplace Environment Nondiscrimination and Diversity Amkor respects, values and welcomes diversity in its workforce, as well as in its customers, its suppliers and the global marketplace. Amkor’s policy is to comply with all applicable laws and to provide equal employment opportunity for all applicants and employees without regard to non-job related factors such as race, color, religion, sex, national origin, ancestry, age, disability, veteran status, marital status or sexual orientation. This policy applies to all areas of employment, including recruitment, hiring, training, promotion, compensation, benefits, transfer, and social and recreational programs. Harassment-Free Workplace Amkor is committed to providing a workplace free of all types of harassment. Amkor strongly disapproves of, and will not tolerate, harassment of employees by managers or co-workers. Amkor will also provide a work environment to protect employees from harassment by non-employees in the workplace. Harassment includes verbal, physical and visual conduct that creates an intimidating, offensive or hostile working environment or that interferes with work performance. Some examples include racial slurs; ethnic or sexual jokes; offensive statements, posters or cartoons; intimidation tactics; distribution of inappropriate jokes or offensive language on electronic mail or any other Amkor computer or networks; use of pornographic screens or software; or other similar conduct. Sexual harassment includes behaviors such as solicitation of sexual favors, unwelcome sexual advances or other verbal, visual or physical conduct of a sexual nature. Open Communication Amkor promotes performance, teamwork and results through open communications. We encourage communications meetings at all sites where employees have the opportunity to share any concerns with senior management. Amkor also supports an “open door” management policy. 4 Employees are encouraged to raise work-related concerns with their immediate manager. If this is not the most appropriate person, they are encouraged to bring their concerns to the attention of the functional manager, Human Resources or any senior manager, up to and including the corporate vice president. Employees can also send their questions to the Amkor Connect newsletter regarding clarification of company values, policies and standard practices. These questions may be sent anonymously, if desired. Performance Management Performance management is an ongoing process of setting clear expectations, holding employees accountable for meeting those expectations, and directly and effectively addressing performance issues. Managing employee performance is a responsibility that is shared by managers and employees. Amkor formally appraises the performance of employees worldwide every year. The evaluation provides the employee with a documented review of performance and may result in a change in compensation. Employee performance is measured against factors such as individual performance expectations, departmental and/or corporate business objectives, contributions to team efforts, performance relative to peers and performance to company values. Input on performance may be gathered from several sources, including managers, peers, subordinates and customers. Performance is documented each March using the Performance Appraisal Form, available on ATDOCs. This form was designed very simply, to allow managers and employees to discuss performance results as well as areas for improvement. Remaining competitive requires that Amkor employees strive for continuous improvement in performance. Amkor encourages employees to take responsibility for their career development by maintaining and developing useful and marketable skills. In addition, managers are encouraged to provide a supportive environment to assist employees in career development. 5 Workplace Violence Amkor has a policy of zero tolerance for violence. Violence includes physically harming another, shoving, pushing, harassing, intimidating, coercing, brandishing weapons, and threatening or talking of engaging in those activities. It is Amkor’s intent to ensure that everyone associated with the business, including employees and customers, never feels threatened by any employee’s actions or conduct. It is everyone’s business to prevent violence in the workplace. Employees can help by reporting any workplace incident that could indicate a co-worker is in trouble. Employees are encouraged to report any incident that may involve a violation of any of the company’s policies that are designed to provide a comfortable workplace environment. Concerns may be presented to your supervisor, human resources, or the legal department. All reports will be investigated and information will be kept confidential. 6 Compensation and Benefits Amkor’s compensation and benefits philosophy, which distinguishes the company and contributes to its success, is an integral part of its culture and management approach. Total Compensation and Philosophy The total compensation approach responds to the cyclical nature of our business. This philosophy is based on creating a pay structure that we can maintain in down cycles while being among the best paying in good times. This is accomplished through a combination of base pay, benefits and variable, profit-driven components such as cash and stock. Equity Pay equity is a method that Amkor uses to ensure that market pay rates are obtained in dynamic growth areas. These pay adjustments typically respond to specific job functions. Competitive Compensation and Benefits Packages To strike a balance between Amkor’s need to be viable and profitable, and the needs and desires of its employees, each country’s compensation package is designed to be competitive with those of a select group of comparable companies within that country. The individual program components of a specific country may differ from local practices in that country to be consistent with Amkor’s culture. 7 Work Hours At Amkor, being at work on time and being available during normal business hours are part of the company’s commitment to its customers and co-workers. Start times are generally consistent with local business start times for the geography in which Amkor operates. Amkor does not support flexible work hours (a program in which employees can arrive at work anytime between set hours). Alternate Start Times Alternate start times (starting at other than the local business start time on a regular basis) are supported only when business requirements can be met or exceeded as a result of the change. Setting an alternate work schedule or start time for an employee or group of employees may be approved by a manager in the following circumstances: u To accommodate a specific shift structure in facilities, manufacturing or other departments that use varied shifts as a part of the business. u To accommodate regular business communication needs with a team or customers in geographies or time zones other than one’s own. u To accommodate an employee who has a disability or family hardship, as long as there is no undue hardship on the business results. u To support local commuter traffic restrictions or requests from the city or country, as long as business requirements are not jeopardized. Employees with alternate start times must have their supervisor’s approval. 8 Environmental, Safety and Health Amkor Technology, Inc. (Amkor) is committed to achieving a safe, healthy and environmentally friendly workplace, and is dedicated to principles and practices of “continuous improvement” in striving to provide high quality Environmental, Safety and Health (ESH) standards and practices for team members, customers, visitors, suppliers and the communities in which we live and work. Amkor shall continue to demonstrate environmental responsibility through compliance with all relevant environmental regulations; implementation and monitoring guidelines; and training of team members to minimize the opportunity for environmental insult to include proper storage, transportation and disposal of hazardous waste materials, conservation of natural resources and energy management. Amkor shall strive to eliminate accidents, occupational injuries and workplace illnesses by providing the appropriate training and support for team members, suppliers, contractors and visitors. Amkor shall ensure that safety and environmental responsibility take precedence over expediency, and that our ESH standards meet international and local requirements. Amkor expects all team members to comply with the ESH policy by getting the appropriate education and training to carry out ESH requirements in all phases of work and business. Amkor shall communicate and make available our ESH policy, objectives and programs to all team members, suppliers, contractors and the public to encourage and promote the positive participation in achieving our goals for environmental responsibility, safety and health. Amkor shall establish and maintain appropriate controls, including periodic reviews, to ensure adherence to this policy. 9 Physical Security Amkor aims to provide a secure business environment for the protection of its employees, products, valuable materials, equipment and proprietary systems and information. Materials, equipment and systems incorporated into the design of facilities and grounds will ensure adequate security in these areas. Security is the responsibility of all employees. Any breach of security should be reported immediately to your supervisor. Identification and Badging Anyone entering an Amkor facility is required to wear an Amkor- issued identification badge. Badges should be visible at all times. All badges are the property of Amkor and must be returned upon request. No modifications or additions should be made that interfere with the visibility, clarity or use of the badge. Amkor Company Assets and Company Right to Search Amkor does not allow the unauthorized removal of company assets or physical property from its premises, or sharing of its intellectual property in an unauthorized manner. To ensure proper protection of our employees and assets, Amkor regulates the possession and movement of assets, subject to the limitations imposed by local law. Areas subject to search include an employee’s workspace, desk, computer, file cabinet, locker or similar place where employees may place personal possessions, whether or not such places are locked. Such inspections or searches may also include, but are not limited to, computer files, floppy disks, hard drives, e-mail or other electronic mail; an employee’s vehicle when on Amkor property; or items of personal property while on Amkor property. 1 0 Internal Information Posting Amkor has a number of methods for posting information located within the facilities and on information systems for the purpose of communicating. Posting in any of these places is limited to company- related material, including statutory and legal notices, safety and disciplinary rules, company policies, memos, announcements of general interest and other items relating to Amkor. All postings require prior approval by the office manager at each site who manages the posting place in question. 1 1 Quality Amkor is committed to pursue quality in every aspect of our business. Therefore, we strive to: u Continuously improve our company – people, processes, product quality and cost of ownership, technology, service and delivery – and achieve/maintain world-class competitiveness in each of these areas. u Build in customer-defined quality at each step as our products are developed, manufactured, delivered and supported. Business Results Successful quality practices will: u Foster adherence to Amkor corporate values and promotes a culture where excellence is expected, commitments are honored, and teamwork, openness, hard work, and dedication to process improvement and quality results are a daily routine for everyone. u Encourage the continuous improvement of our products, processes, and people to become better, faster and more cost effective in everything we do. u Require us, individually and collectively, to understand the needs of our internal/external customers and satisfy them in a way that ensures mutually beneficial business results. u Promote the quest for quality and competitiveness at Amkor, in the semiconductor business, global industry and the communities where we live. Deployment All managers will: u Provide quality leadership and direction for all management functions and quality related activities at Amkor. u Ensure each employee understands the Code of Business Conduct and Ethical Guidelines. 1 2 u Provide the appropriate environment for each employee to implement the Quality principle. All employees will: u Talk, act and make decisions consistent with the tenets of this principle. u Promote teamwork and support the improvement efforts of others for the good of Amkor as a whole. 1 3 Assets Use and Protection of Assets Protection of Company Assets Every Amkor employee is responsible for protecting the assets of the company. Each employee is also responsible for understanding Amkor’s obligations for protecting assets that have been entrusted to it by customers or suppliers, and for treating them accordingly. The company’s assets include physical assets, such as equipment and buildings, as well as our funds, intellectual property, trade secrets and confidential information. To protect Amkor’s assets, they must be adequately safeguarded. This means locking up and securing valuable assets. Amkor’s assets may not be sold, borrowed, lent, given away or modified in any way that would impact their value, unless there is a good business reason and with approval of the department manager. Use of Company Resources Company resources, including (but not limited to) cash, personnel, equipment and vehicles may only be used for legitimate company business purposes. Some sample situations: u An Amkor employee may not make business trips or purchase an airline ticket at a premium price just to obtain frequent flier miles or other awards for his or her private use. u No one outside the company may have access to our computers. u In some cases, using an Amkor PC to do personal work is permissible if it is clearly outside of business hours and you have your manager’s approval. Be sure that you and your supervisor agree on the exact meaning of “outside of business hours.” Information Security Confidential information generated by or used in any company business activity is considered an information asset. This includes (but is not 1 4 limited to) information originating from direct access to computer systems, information carried over networks, information preserved on portable electronic media and information appearing in hard-copy format. At the time of hire, all employees must sign an agreement to protect Amkor’s confidential information and intellectual property rights during and after employment with Amkor. Upon termination of employment, employees must provide Amkor with any company owned material or proprietary information (i.e., patents, designs, data), and authorize ownership of that information to Amkor. Amkor requires that each employee be personally responsible for safeguarding the company’s information assets, in all its various forms, from loss, inappropriate modification and disclosure to anyone who lacks either the authorization or the need-to-know. All employees are required to: u Protect the confidentiality of information such as product roadmaps, strategic long-range plans, product pricing, and employee salary data, which, if disclosed, could cause financial or other damage to Amkor. u Hold in confidence and not use (except for the benefit of Amkor) any confidential information that they have access to or that was created by them while employed at Amkor. u Protect third-party confidential information in the manner required by the terms of the Memorandum of Agreement. If such terms are not known, that information should not be used, copied or disclosed until the terms of the Memorandum of Agreement are known. u Ensure that confidential information that may need to be released to customers or suppliers is handled properly. In such cases, an employee must have received proper authorization (approval from their manager or the Legal Department) and must ensure that the recipient has a need-to-know and signs a nondisclosure agreement. 1 5 Requests for confidential information from outside sources must be handled only by authorized persons. u Be personally accountable to Amkor and legally accountable for their actions. Emergency Management Plan Amkor aims to provide its customers with flawless delivery of the products and services they need and want. Amkor recognizes that a wide variety of natural, human-caused, and physical and information system failures can happen. Plans must be in place and responsible people trained at all sites to ensure that employees, guests and neighbors are protected from injury; that Amkor’s assets are protected from damage or loss; and that the effects of such an incident do not severely compromise Amkor’s ability to achieve its mission. Although these incidents cannot always be avoided, reducing the duration of an unplanned outage may control their severity. This may be accomplished by repetitively exercising recovery plans to ensure that they work when needed, and by taking preventative actions and measures to reduce the risk or impact when an occurrence is likely (such as in war zones). Every major site and function must have an Emergency Management Plan reviewed by management and tested annually. Preparations must include a cost-effective combination of emergency response, recovery planning, protection of critical data via backup, and secure storage and interim processes until normal services can be resumed. During emergency situations, Amkor’s communications with the press must be timely, honest and accurate, and they should not compromise the company’s reputation. Except for designated spokespersons, individual employees should not respond to public inquiries from the press or any other forum during a time of emergency. 1 6 Employee Reimbursement/Advances Amkor’s intention is to fund management-approved business travel, education, relocation, in/expatriate expenses, business entertainment and other expenses necessary to conduct its business. The employee is responsible for the accuracy, completeness and timely filing of the required forms, including appropriate backup documentation for receiving reimbursements, advances of funds or credit card purchases. It is the responsibility of the approving manager to ensure that reimbursable expenses or funds advanced are reasonable, ordinary and necessary to conduct Amkor’s business. In addition, Human Resources is responsible for collecting funds and credit cards from terminating employees. 1 7 Ethics and Compliance Bribes, Kickbacks, Gifts and Gratuities Bribes and Kickbacks Amkor employees may not offer or accept a bribe or a kickback. A bribe is defined as a thing of value given to someone with the intent of obtaining favorable treatment from the recipient. Kickbacks consist of payment in cash or in kind, including goods, services, the use of another company’s property, or forgiving any sort of obligation provided to a customer or supplier for the purpose of improperly obtaining or rewarding favorable treatment in connection with a sale or purchase. Bribes and kickbacks may not be offered either directly or through a third party in order to obligate the recipient to return the favor. Sample Situation: u Paying a freight forwarder to expedite a shipment through customs is not acceptable if the agent doesn’t follow applicable rules and regulations, and if the agent gives money or payment in kind to a government official for personal benefit. On the other hand, expediting by following rules and regulations and without bribing officials is acceptable. u Questions about specific cases should be sent to the Legal Department. Receiving Gifts and Gratuities Any form of a gift that obligates an employee is a bribe and is forbidden, regardless of its value. Cash gifts are not allowed, whether for referring an Amkor employee to a recruiter, for purchasing favors or for sales to outside parties. A sample from a customer or supplier is Amkor property and is not for personal use or profit. No entertainment shall be accepted in any circumstance from present or potential suppliers, unless it is a multi-customer event, sanctioned in a professional environment and does not, or appear to, influence purchasing decisions, create a conflict of interest or violate rules or proprietary exchanges of information. No favors, services, travel or lodging of any kind from present or potential suppliers may be accepted. 1 8 Working meals are acceptable if the work performed is proximate to a supplier or third party facility and passes the common sense test for reasonable behavior in a business environment. Promotional items with company logos are acceptable as long as their value is less than $100. If an employee is not sure of an item’s value, the item should be returned. If it cannot be returned, it must be turned over to the company; both the giver of the gift and the employee’s manager should be informed. The gift can then be given to a charitable organization. If employees know that they will receive a gift of value, they can suggest that instead of a gift, a donation be made in their honor to a charity. Some Sample Situations: u Business discussions held at lunch or dinner are legitimate. A free private meal for an employee and spouse is not a legitimate function. u An invitation to an entertainment or sporting event such as a golf or tennis tournament may be appropriate if it demonstrably helps build a business relationship. When unsure about proper conduct, employees should describe the situation to their manager and the Legal Department. Policy violations should be reported promptly to the Legal Department. Giving Gifts and Gratuities Equivalent rules apply to the giving of gifts. Obviously, they should not be offered as bribes. Employees should also take care to avoid giving gifts that are intended to be innocent but may be construed as a bribe. Special care must be taken with gifts to government officials; strict rules apply (see the Special Government Ethics Rules at the end of this section). An acceptable gift to a business person might be perceived as a bribe to a government worker. When in doubt, contact the Legal Department. 1 9 u It is permissible to give away plaques, supplier awards and prizes that are part of official programs with fair, openly-published rules for competing companies. u Samples may not be provided to a customer for private use. Free access to company resources or assets, such as computer time, and scrap or excess materials, is expressly forbidden. u In some countries other than the U.S., local customs require the exchange of gifts under certain circumstances. In these cases, the country manager may ask for an exception through a written request to the Legal Department. Such requests must specify the manager’s understanding of the country’s customs and the proposed rules for gift giving and receiving, including the occasions on which such gifts may be exchanged and the dollar equivalent value of such gifts to be permitted. If approved, the country manager may publish such rules to affected employees on an exception basis. Gifts outside the provisions of the approved local rules cannot be given or received without approval from the Legal Department. Ethics Hotline Employees are encouraged to report any compliance-related issues to their management, human resources or the legal department. In some circumstances, employees may wish to maintain their anonymity and Amkor has established an anonymous and confidential reporting procedure for these incidents. The Ethics Hotline numbers are on page 26. 2 0 Conflict of Interest and Disclosure It is Amkor’s policy that all employees avoid any activity that is or has the appearance of being hostile, adverse or competitive with the company, or that interferes with the proper performance of their duties, responsibilities or loyalty to the company. An employee’s best course of action is to review the specific situation with his or her supervisor to assess whether there are any problems and, if so, how they can be resolved. If the employee’s supervisor concludes that there is or may be a perceived conflict of interest, the manager will consult with the Legal Department. The Legal Department will work with the director of Purchasing, the regional sales manager or appropriate employee management to determine if there is a real or perceived conflict of interest. If a conflict exists, it may be necessary to transfer that employee, require the employee to divest himself or herself of the interest, or remedy the situation as a condition of continued employment. Some Sample Situations: u If an employee is in a position to influence the business situation of a supplier or customer, the employee must disclose to his or her supervisor all financial, proprietary or other type of controlling or influencing interest (for example, a member of the immediate family or a close personal friend) that the employee may directly have. (Note: Financial or proprietary interest includes investments, ownership of securities or loan agreements.) u Any employee in a position to influence the purchase of materials or services must formally declare any situation wherein a member of the employee’s immediate family or a close personal friend is employed by Amkor’s supplier. A Conflict of Interest form is normally used to make this declaration. u It is not Amkor’s policy to discourage the employment of family members or employees’ close personal friends as suppliers or competitors. Clearly, everyone is entitled to pursue a career of his or her choice. It is the company’s intention, however, to ensure 2 1 that neither real nor apparent influence is exerted in its business relationships as a result of such employment. u Amkor will not conduct business with a former employee who becomes employed by a supplier or who offers his or her services as an independent contractor for a period of 12 months from the employee’s termination date, without prior written approval from the vice president of Purchasing. u An employee may not directly or indirectly conduct outside business that interferes with the proper performance of the employee’s job at Amkor, is conducted during an employee’s normal working hours, or utilizes Amkor confidential information or specialized skills and knowledge gained as an employee of the company. This includes becoming a contractor, consultant or supplier to Amkor while being employed at Amkor. u Employees may not enter into any short sales or short positions with respect to Amkor securities. Public Disclosure Certain employees who are in particularly sensitive positions are required to complete a Conflict of Interest form each year. The Internal Audit Department will provide these forms. The completed and signed forms must be returned to the Internal Audit Department. Employees completing Conflict of Interest forms must properly notify the Internal Audit Department of any changes to their responses. 2 2 Antitrust Compliance The purpose of antitrust laws in the United States and other countries where Amkor does business is to encourage competition, which benefits consumers by prohibiting unreasonable restraints on trade. It is company policy to compete vigorously while at the same time adhering to both the letter and spirit of antitrust laws. Some of the more common antitrust problem areas are discussed next. Restraints of Trade Any agreement, understanding or arrangement expressed or implied, formal or informal, in restraint of trade or commerce is prohibited by antitrust laws. All employees must avoid even the appearance of engaging in the following types of activities. All questions should be referred to the Legal Department. Dealing with Competitors It is against Amkor policy to have a discussion or communication with any competitor relating to price or any matter that affects pricing, including costs, credit terms, allocation of markets, geographies, customers or lines of business. 2 3 Using Insider Information All employees may at some time have access to information related to the company or its business that is not known to the general public. This is known as “insider information.” It is Amkor policy that insider information may not be used at any time for improper purposes. Protecting Insider Information All employees should take care to use insider information about Amkor or its business with another company only in the course of performing their jobs. Employees may not disclose insider information to anyone outside the company, except for the purpose of conducting company business. Stock Transactions and Material Inside Information Some insider information may be considered material; that is, it is information that could affect Amkor’s stock price. If an employee has material insider information about the company, that employee should not trade in company stock until the information is released to the public. Some examples of information that may be material are financial results, plans to acquire another company or planned key product announcements. Certain material insider information that is related to company business may not affect the stock price, but may affect the stock price of another company or the value of other investment opportunities. An Amkor employee may not use this material insider information to gain personal financial benefit. This type of insider information would include, for example, Amkor’s plan to make a major investment in another company or to award a large piece of business to a supplier. In all situations, if an employee is prohibited by this policy from acting for his or her own benefit (for example, by trading stock or investing), that employee may not “tip” another person to act. 2 4 Securities laws prohibit trading stock based on material insider information. A violation of these laws can result in civil and criminal penalties. Any issue regarding this type of transaction should be reviewed with the Legal Department. 2 5 External Communications Public Relations/Press It is Amkor’s intention to maintain open and consistent communications with the media. To ensure the accuracy of all information provided, spokespeople are designated to respond to all inquiries. Except for designated spokespeople, individual employees should not respond on Amkor’s behalf to policy inquiries in any public forum, including the Internet, on-line services and the press – even when they are visiting our facilities. All press inquiries should be forwarded immediately to the director of Marketing Communications, to the local Public Relations manager or to a designated spokesperson. Employee Posting on the Internet Amkor employees may choose, or be required by their jobs, to participate in public forums on the network, Internet mailing lists and so on. Employees may not represent Amkor’s corporate opinion in these forums unless they have been specifically asked to do so. To avoid confusion, employees should indicate in their postings that the views they express are their own and not those of Amkor. If the posting is not obviously from an Amkor site, employees should clearly identify their affiliation with Amkor. Employees should remember that, even with this disclaimer, they will be identified with Amkor and that their network behavior reflects on the company in a broader way. In addition, employees should never comment on confidential or internal company matters, and should never comment on pending legal actions involving Amkor, its customers or its partners. All comments should be well informed and within the employee’s sphere of expertise. Further, if the posting affects others at Amkor those affected should be copied on the posting or be advised of it in advance. 2 6 Phone Numbers Human Resources ................................ 83-501-5097 Legal ..................................................... 83-101-5607 Audit ...................................................... 83-101-5520 Purchasing ............................................ 83-501-5214 Marketing Communications ................. 83-501-5130 Ethics Hotline ....................................... 83-501-5069 Anonymous Ethics Hotline .. 1-480-821-2408 x5069 Acknowledgement Form I have read Amkor’s “Code of Business Conduct and Ethical Guidelines” brochure and understand that as an employee of Amkor Technology, I am expected to comply with these guidelines. Signature Print Name Date Please return to Human Resources in Chandler, Arizona.",
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